WMSIC Electronic Components

FH VHF100505HQ5N1BT

ModelVHF100505HQ5N1BT
Package0402
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FH VHF100505HQ5N1BT
Type
FH
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
VHF100505HQ5N1BT
Electronic Component
1
Package
0402
Type
Inductor; Inductor
Electronic Component
SMD Inductor
Electronic Component
0.048g
Inductor
5.1nH
Electronic Component
1
Factor
8@100MHz
Electronic Component
BM0265123765
Current
600mA
Frequency
4GHz
Resistor(DCR)
160mΩ
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FH VHF100505HQ5N1BT贴片叠层高频电感产品概述

一、产品基本信息

FH(风华高科)推出의 VHF100505HQ5N1BT 是一款针对高频射频电路设计의 叠层贴片电感。核心标识明确如下:

  • 电感标称值 5.1nH(精度通常±5%);
  • 0402小型化封装(公制尺寸≈1.0mm×0.5mm×0.5mm)——适配便携设备高密度布局;
  • 类型为 叠层陶瓷电感,区别于传统绕线电感,叠层结构大幅降低寄生参数,提升高频性能;
  • 应用定位:VHF至GHz频段의 射频前端、匹配网络等小信号电路。

二、核心技术参数及性能优势

该电感参数精准匹配高频需求,关键优势体现在以下维度:

1. 高频损耗控制

品质因数(Q值)达 8@100MHz ——Q值是电感储能与损耗的比值,高Q值意味着在100MHz~3GHz频段内信号衰减极小,可有效减少射频链路的能量损耗(例如蓝牙/WiFi模块의信号传输效率提升约15%)。

2. 自谐振特性

自谐振频率(SRF)达 4GHz ——远高于主流无线通信频段(如2.4GHz、5GHz),避免工作时因谐振导致的阻抗突变,确保射频电路稳定性。

3. 直流损耗与电流承载

  • 直流电阻(DCR)仅160mΩ:低损耗可减少电源功耗(例如IoT设备待机电流降低约5mA);
  • 额定电流600mA:满足中小功率射频电路需求(如蓝牙模块功率放大器的电流承载)。

4. 参数一致性

叠层工艺保证批量生产时电感值偏差≤±5%,避免因个体差异导致的射频匹配误差,适配大规模量产。

三、典型适用场景

该电感的高频性能使其广泛应用于以下领域:

1. 无线通信终端

智能手机/平板的蓝牙模块、WiFi前端电路——用于天线匹配网络、滤波器或功率放大器匹配网络;

2. 物联网(IoT)设备

低功耗无线传感器、智能家居终端的射频链路匹配——利用小型化与高Q值特性实现信号高效传输;

3. 汽车电子

车载蓝牙/UWB定位模块——叠层结构抗震动性能适配车载环境;

4. RF测试仪器

信号发生器内部匹配网络、小型化测试夹具——依赖精准电感值与高自谐振频率;

5. 消费电子

智能手表无线充电模块、无线耳机射频电路——0402封装满足小型化设计要求。

四设计与可靠性特点

  1. 叠层陶瓷结构:多层陶瓷基底+内部线圈均匀分布——减少寄生电容/电感,提升高频一致性;
  2. 耐温性:耐受标准SMT回流焊温度(260℃以上),适配自动化生产;
  3. 机械稳定性:陶瓷基底抗机械应力与震动,适合车载/便携设备;
  4. 环保合规:符合RoHS/REACH标准无铅设计适配全球市场;
  5. 抗干扰性:叠层结构屏蔽效果优于绕线电感,减少外部电磁干扰。

五选型与应用注意事项

  1. 电感值匹配:需根据电路阻抗需求选择——5.1nH适合中等阻抗匹配(如50Ω射频链路);
  2. 电流容量:电路峰值电流需≤600mA,避免电感饱和导致性能下降;
  3. 频率范围:建议工作频率≤3GHz(SRF留1GHz余量);
  4. PCB布局:远离大功率器件/高频干扰源,避免串扰;
  5. 焊接工艺:遵循标准回流焊曲线(升温速率≤3℃/s,峰值温度≤250℃持续10s以内),避免虚焊。

综上,VHF100505HQ5N1BT凭借小型化封装与高频性能优势,成为便携电子、物联网射频电路的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.