Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
FH RS-03K223JT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FH RS-03K223JT
- Type
- FH
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- RS-03K223JT
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±5%
- Electronic Component
- 0.03g
- Electronic Component
- 22kΩ
- Electronic Component
- 10
- Electronic Component
- BM0000001286
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：RS-03K223JT 贴片电阻
一、产品描述
RS-03K223JT 是一种高性能的贴片电阻，采用的材质为厚膜材料，其额定功率为100毫瓦（mW），电阻值为22千欧（kΩ），公差为±5%。该元件的封装形式为0603（英寸），是一种常见的SMD（表面贴装设备）封装类型，非常适合用于现代电子产品的高密度布线。
二、技术规格
电阻值：22kΩ
- 该电阻值表明在标准工作条件下，该元器件在电流流过时会产生相应的电压降，广泛应用于各种电路的偏置和限流等功能。
额定功率：100mW
- 该元件在额定功率下工作会确保安全和稳定。100毫瓦的功率适合用于低功耗应用和小型电路，有助于减小设备热量的产生，提高整体效率。
公差：±5%
- 这意味着电阻值的实际值可能会在21.0kΩ到23.0kΩ的范围内波动。这种公差适用于对成本和性能要求较为宽松的消费类电子产品。
封装类型：0603
- 尺寸为0.06英寸 x 0.03英寸（约1.6mm x 0.8mm），这一尺寸非常适合在空间受限的应用中嵌入，能够实现高密度的电路设计，同时支持自动化贴装工艺。
材料：厚膜
- 厚膜电阻以其较低的成本和良好的温度系数而广泛应用于各种场景，对于日常电子设备是一个优秀的选择。
三、应用场景
RS-03K223JT 贴片电阻因其特性，广泛应用于以下场合：
消费类电子产品：如智能手机、平板电脑、家用电器等，通常需要低功耗和高可靠性的电子元件以满足其复杂电路设计。
工业设备：在机器监控、信号处理等模块中，该电阻可以有效地充当信号调节、偏置电路中的关键组件。
汽车电子：在电池管理系统和车载信息娱乐系统中，高可靠性的电阻器能够确保车辆电气系统的稳定性与安全性。
医疗设备：如监控仪器与诊断工具，要求高精度和稳定性的电阻器对设备的精准度至关重要。
四、产品优势
高精度与稳定性：厚膜电阻的技术特性使其具备较为优秀的稳定性，适用于各种工作环境，降低了电路故障的风险。
小型化设计：0603封装的设计使其能在空间受限的应用中保持设计的灵活性，帮助工程师完成更紧凑的布局。
易于贴装：该SMD电阻器兼容多种自动贴片机，适合大规模生产，提高了生产效率，降低了制造成本。
良好的热性能：厚膜材料在热管理上表现良好，可以承受一定的温度变化，保证产品在不同工作环境下的安全性。
五、总结
综上所述，RS-03K223JT 贴片电阻凭借其100mW的额定功率、22kΩ的电阻值和±5%公差，成为现代电子设备设计中不可或缺的重要元件。其0603封装和厚膜技术确保了元件在各种应用中的优良性能与可靠性，是电子工程师在选择电阻器时的优质选项。对于需要高可靠性、低功耗与小型化设计的电路而言，RS-03K223JT 贴片电阻无疑是一个理想的选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
