Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
FH 0603CG201J500NT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- FH 0603CG201J500NT
- Type
- FH
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- 0603CG201J500NT
- Electronic Component
- 1
- Electronic Component
- 200pF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.03g
- Electronic Component
- 1
- Electronic Component
- BM0257366508
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0603CG201J500NT 产品概述
一、产品简介
0603CG201J500NT 为风华（FH）生产的多层陶瓷贴片电容（MLCC），标称容值 200pF（201 编码），容差 ±5%（J），额定电压 50V，温度特性为 C0G（又称 NP0），封装为 0603（约 1.6 × 0.8 mm）。此类电容以温度稳定性和低损耗著称，适用于对频率特性和稳定性要求高的电路。
二、主要参数
- 容值：200 pF
- 精度：±5%（J）
- 额定电压：50 V
- 温度系数：C0G / NP0（温漂接近零、线性良好）
- 封装：0603（贴片）
- 品牌：风华（FH）
三、特性与优势
- 温度稳定性高：C0G 材料在宽温度范围内几乎无电容漂移，适合精密滤波与频率元件。
- 低介质损耗：Q 值高，适合射频与高频信号路径。
- 低介质吸收与良好线性：在谐振、电感耦合及定时电路中表现稳定。
- 小尺寸、易贴装：0603 封装兼顾体积与可加工性，适合高密度 PCB 布局。
四、典型应用场景
- 高频滤波、匹配电路与谐振回路（RF 前端、振荡器）
- 精密定时与频率控制电路（相位噪声与漂移敏感场合）
- 高稳定性耦合/去耦、采样网络与模数/数模转换电路（ADC/DAC）
- 消费电子、通信设备、仪器仪表等微型化产品
五、封装与焊接注意事项
- 适用于 SMT 回流焊工艺；请参照厂商推荐回流曲线进行无铅焊接。
- 放置时避免在焊接过程中产生过大温度梯度或机械应力，以防裂纹或性能退化。
- 长期储存建议避光、低湿环境，必要时按供应商建议进行干燥处理。
六、选型与订购提示
选择此型号时，请确认工作电压裕量（建议额定电压大于实际工作电压）、频率特性需求及封装空间。订购时可向供应商确认包装形式（常见为卷带 Tape & Reel）、检验报告与放电老化等质量文档，以满足量产可靠性要求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
