WMSIC Electronic Components

FH 0402B473K250NT

Model0402B473K250NT
Package0402
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
FH 0402B473K250NT
Type
FH
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
0402B473K250NT
Electronic Component
1
Electronic Component
47nF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.022g
Electronic Component
1
Electronic Component
BM0257366512
Electronic Component
X7R
Voltage
25V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:0402B473K250NT

一、基本信息

0402B473K250NT 是一款高性能的贴片电容(多层陶瓷电容,MLCC),由知名品牌 FH(风华)制造。其封装类型为0402,符合业界标准,适合各种电子电路设计需求。这款电容的主要参数包含了47nF的容值、±10%的精度、25V的额定电压以及温度系数为X7R的材料,广泛应用于多种电子设备中。

二、参数解析

  1. 容值:47nF(纳法拉)
    这一容值在多种应用中十分常见。特别适用于高频滤波、耦合和去耦合等电路中。其适用频率范围广泛,能够在不同的电信号情况下稳定工作。

  2. 温度系数:X7R
    X7R是一种钛酸锶的陶瓷材料,具有良好的温度特性。在-55°C到+125°C的环境温度范围内,其电容量变化不超过±15%。这使得0402B473K250NT能在较为恶劣的环境条件下可靠稳定地工作,适合许多温度敏感应用。

  3. 精度:±10%
    该电容的容值误差为±10%,对大多数应用而言,这是一个合理的精度水平。可以满足一般电路对电容器容值的要求,对于需要严苛控制电容容值的电路,则可能需要进一步考虑更高精度的电容。

  4. 额定电压:25V
    该电容的额定电压为25V,适合大多数常规电路供电环境。为保证电容在电路中的长期稳定性和可靠性,建议在实际应用中将工作电压控制在额定电压的70%-80%左右。

  5. 封装尺寸:0402
    0402封装是目前较为流行的微型封装尺寸,具有占用空间小、节省布局面积等优点,适合现代电子产品对于空间的优化需求。该封装尺寸也为表面贴装技术(SMT)的应用提供了便利。

三、应用场景

0402B473K250NT 适用于多种电子应用,包括但不限于:

  • 手机和可穿戴设备:在这些设备中,通常需要小型化和高集成度的电子元器件,此电容凭借其0402的小封装尺寸,适合用于扬声器、电源去耦合和RF滤波等多个模块。

  • 计算机和周边设备:在计算机主板和外围设备中,470nF的电容值能够有效降低噪声和干扰,保证信号的稳定性,提升整体性能。

  • 汽车电子:在现代汽车的电子控制系统中,0402B473K250NT可用于信号处理、传感器电路等关键应用,提供必要的稳定性和可靠性。

  • 家电产品:随着智能家电的普及,这类元器件也广泛应用于洗衣机、冰箱等设备中的控制板上,兼顾降低功耗和提高整体效率。

四、优势与特点

  • 出色的温度稳定性:由于采用了X7R温度系数材料,因此在极端环境下,0402B473K250NT表现出的容量稳定性大大优于其他类型的电容器,适用于大部分需要耐受温度变化的场合。

  • 小型化设计:0402封装使得该电容在现代电子产品设计中更为灵活,能有效节省PCB的空间,使得电路板设计更为紧凑,适应当下不断追求小型化的电子产品趋势。

  • 可靠性:FH(风华)品牌作为知名的电子元器件制造商,产品经过严格的测试和认证,具有良好的长期可靠性,在多个行业中得到了广泛认可与应用。

结论

0402B473K250NT 是一款功能强大、高效能的贴片电容产品,凭借其优越的性能特点、合适的封装尺寸以及良好的品牌声誉,成为众多电子设计工程师的首选。无论是在消费电子、计算机、汽车电子还是家用电器领域,这款电容都能有效满足设计要求,助力电子工程的实现与创新。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.