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FH RC-02K511JT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FH RC-02K511JT
- Type
- FH
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- RC-02K511JT
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±5%
- Electronic Component
- 0.022g
- Electronic Component
- 510Ω
- Electronic Component
- 50
- Electronic Component
- BM0257714179
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RC-02K511JT 产品概述
一、基本特性
RC-02K511JT 为风华（FH）系列贴片厚膜电阻，属 0402 封装微型贴片电阻。该型号典型描述为：厚膜工艺、阻值 510 Ω、容差 ±5%（J）、额定功率 62.5 mW（1/16W）、最高工作电压 50 V、温度系数 ±100 ppm/℃，工作温度范围 -55℃ ~ +155℃。体积小、稳定性好、适合高密度贴装的消费类与工业类电子产品。
二、主要电气参数
- 阻值：510 Ω（标称）
- 精度：±5%（J）
- 额定功率：62.5 mW（0402 常见额定功率）
- 最高工作电压：50 V（器件允许的最高电压，需结合功率限制使用）
- 温度系数（TCR）：±100 ppm/℃
- 工作温度：-55℃ ~ +155℃
说明：虽然器件标称最高工作电压为 50 V，但必须满足功耗限制。按功率极限计算允许的最大稳态电压： Vmax = sqrt(P × R) = sqrt(0.0625 W × 510 Ω) ≈ 5.65 V， 超过此电压则会使器件功耗超过额定值，存在过热或失效风险。
三、机械与封装信息
RC-02K511JT 采用 0402（公制约 1.0 mm × 0.5 mm）超小封装，厚度典型约 0.3–0.4 mm。经典贴片端电极设计，适配自动贴装与回流焊工艺。为了确保良好焊接与可靠性，建议按厂家资料所示的焊接温度曲线与焊盘设计布局。
四、热性能与降额建议
- 器件额定功率通常以 70℃ 为基准，在高温工作时应进行降额。一般情况为超过某一参考温度后线性降额，到最高工作温度（+155℃）时接近降为 0。具体降额曲线请参照风华官方 Datasheet。
- 建议在设计中预留热裕量，避免在小电阻值或高电压下造成局部过热。合理布线与散热可以提高可靠性。
五、应用场景
适用于需要体积小、精度中等、温度范围宽的电阻场合，例如：
- 移动终端、可穿戴设备的分压、偏置电路；
- 通信设备、消费类电子中的信号链与滤波网络；
- 低功耗传感器与测量电路中的定值电阻；
- 大批量 SMT 生产场景，需要高密度贴装与自动化装配。
六、选型与注意事项
- 若电路中电压可能超过约 5.6 V（在 510 Ω 时），应重新评估功耗或选择阻值/功率更大的器件；
- 对温漂敏感的场合建议选择更低 TCR（如 ±50 ppm/℃ 或更好）或采用配对与温度补偿设计；
- 回流焊工艺请参考风华的回流温度曲线，常见兼容无铅回流（峰值温度典型 ≤ 260℃）；
- 生产采购时确认包装（卷带/盘装）、湿敏等级与检验报告，按 PCB 焊盘推荐尺寸设计贴片焊盘。
如需完整技术细节（封装精确尺寸、降额曲线、可靠性试验数据等），建议索取风华官方 RC-02K511JT 数据表以便于最终设计与认证。
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