WMSIC Electronic Components

FH RC-02K3742FT

ModelRC-02K3742FT
Package0402
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FH RC-02K3742FT
Type
FH
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
RC-02K3742FT
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.022g
Electronic Component
37.4kΩ
Electronic Component
10
Electronic Component
BM0257437690
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RC-02K3742FT 产品概述

一、产品简介

RC-02K3742FT 为风华(FH)系列贴片厚膜电阻,封装为 0402(公制 1005),标称阻值 37.4kΩ,阻值精度 ±1%,额定功率 62.5mW,额定工作电压 50V,温度系数(TCR)±100ppm/℃,工作温度范围 -55℃ 至 +155℃。该器件以稳定的厚膜工艺制造,适合对体积和精度有中等要求的消费类和工业类电子产品。

二、主要技术参数

  • 阻值:37.4 kΩ
  • 精度:±1%(J级)
  • 封装:0402(1005)
  • 额定功率:62.5 mW(常温下)
  • 最大工作电压:50 V
  • 温度系数:±100 ppm/℃(典型厚膜等级)
  • 工作温度:-55℃ ~ +155℃
  • 制造工艺:厚膜贴片电阻

三、性能特点

  • 小型化封装(0402):占板面积小,适合高密度贴片电路和便携设备。
  • 较高精度:±1% 满足滤波、分压、阻抗匹配及大多数模拟前端和数字电路的阻值要求。
  • 宽温度范围:-55℃ 至 +155℃,可在较苛刻的工业环境下长期工作。
  • 稳定性与一致性:厚膜工艺在常规使用条件下提供良好的阻值稳定性与可重复性。

四、典型应用场景

  • 移动终端、可穿戴设备的分压与偏置网络
  • 电子仪表、传感器信号调理中的精密分压和阻抗匹配
  • 工业控制与物联网终端的通用电阻应用
  • 高频滤波与RC时序控制(需考虑额定功率与寄生参数)

五、设计与选型建议

  • 功率裕量:0402 封装功耗有限,建议在设计时留有足够的功率裕量(通常设计工作功耗 ≤ 50% 额定功率),以提高可靠性和寿命。
  • 电压限制:使用时应确保工作电压不超过 50V,且对瞬态过压采取保护措施。
  • 温漂考虑:±100ppm/℃ 的温度系数适合多数场合,但若为高精度温度敏感应用,应考虑更低 TCR 的薄膜电阻或配对温度补偿。
  • 串并联方案:当需要更高功率或更精准阻值时,可采用并联/串联组合替代单只 0402 电阻。

六、焊接与可靠性注意事项

  • 推荐按照元厂或 IPC/JEDEC 标准的回流焊工艺曲线进行焊接,避免超过推荐峰值温度和暴露时间以防损伤。
  • 贴片回流后建议进行外观检查与必要的阻值测试,保证焊点可靠性。
  • 存储与搬运时避免潮湿环境,必要时按厂家建议进行烘烤处理以防吸湿。

七、采购与合规

  • 型号标识建议按完整料号向供应商确认 RC-02K3742FT 的包装、出货形式(卷带/盘装)及最小起订量。
  • 环保与认证(如 RoHS、REACH 等)建议向风华或授权代理确认具体合格证书,以满足项目合规要求。

如需我帮您生成该器件的PCB布局建议、并联/串联计算示例,或根据实际工作条件(温度、最大电压、耗散功率)进行老化与可靠性评估,请提供具体使用环境参数,我可为您做更精确的设计建议。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.