Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RC-02K3401FT是风华电子(FH品牌)推出的通用型厚膜贴片电阻,定位于中低功率、紧凑空间的电路应用场景。该产品以稳定的精度、宽温区适应性为核心优势,适配消费电子、工业控制、车载等多领域的常规电路需求,是量产项目中平衡性能与成本的优选器件。
标称阻值为3.4kΩ(3400Ω),精度等级为**±1%**——该精度可满足多数电路的信号匹配、分压/分流、滤波等需求,避免因阻值偏差导致的信号失真或功能异常,适用于对精度要求非极端的常规应用场景。
额定功率为62.5mW(0.0625W),符合0402封装厚膜电阻的常规功率等级。实际应用中需注意:电路功耗不得超过额定功率(建议环境温度较高时降额至80%以内),避免过热导致阻值漂移或器件损坏。
温度系数为**±100ppm/℃,表示温度每变化1℃,阻值变化幅度为±0.01%。结合-55℃~+155℃的工作温区(跨度210℃),最大阻值变化量约为±2.1%**,叠加±1%精度偏差后,总波动仍处于工程可接受范围。
覆盖**-55℃至+155℃**,满足工业级温度要求,可应对车载低温启动、户外温差变化等场景,无需额外增加温度补偿电路。
该产品采用0402封装(英制尺寸,对应公制1005),物理尺寸约为1.0mm×0.5mm×0.3mm(长×宽×高),体积紧凑,适合高密度PCB设计(如智能手机、小型路由器的多层板)。
封装工艺为表面贴装(SMD),电极采用金属化层结构,附着力强,可兼容回流焊、波峰焊等常规SMT制程(回流焊峰值温度≤260℃,持续时间10~30s),焊接后无虚焊、脱落风险。
风华电子(FH)是国内电子元器件龙头企业,拥有30余年厚膜电阻生产经验,产品通过ISO 9001、IATF 16949(汽车级)等认证,月产能达千万级,批量供货稳定;售后提供技术选型支持与问题响应服务,满足量产项目的持续供应需求。
该产品以高性价比、稳定可靠的特性,成为众多通用电路设计的主流选择,可有效降低项目成本并保障电路性能。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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