Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
FH RC-02K821JT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FH RC-02K821JT
- Type
- FH
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- RC-02K821JT
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±5%
- Electronic Component
- 0.022g
- Electronic Component
- 820Ω
- Electronic Component
- 10
- Electronic Component
- BM0265398759
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RC-02K821JT 产品概述
1. 产品简介
RC-02K821JT 是一款由风华（FH）公司生产的贴片电阻，属于厚膜电阻系列。该电阻具有高精度、高稳定性和优异的温度特性，广泛应用于各种电子设备中，如消费电子、通信设备、工业控制等领域。其封装形式为0402，适用于高密度电路板设计，能够有效节省空间。
2. 主要参数
- 功率：62.5mW
- 阻值：820Ω
- 精度：±5%
- 温度系数：±100ppm/℃
- 工作温度范围：-55℃ ~ +155℃
- 最大工作电压：50V
- 电阻类型：厚膜电阻
- 封装：0402
3. 产品特点
- 高精度：RC-02K821JT 的精度为±5%，能够满足大多数电子电路对电阻精度的要求，确保电路的稳定性和可靠性。
- 宽工作温度范围：该电阻的工作温度范围为-55℃ ~ +155℃，适用于各种极端环境，确保设备在高温或低温条件下仍能正常工作。
- 优异的温度特性：温度系数为±100ppm/℃，表明该电阻在不同温度下的阻值变化较小，适合对温度稳定性要求较高的应用场景。
- 高功率密度：尽管封装尺寸仅为0402，但其功率达到62.5mW，能够在有限的空间内提供较高的功率处理能力。
- 厚膜技术：采用厚膜电阻技术，具有较高的可靠性和耐久性，能够在长时间使用中保持稳定的性能。
4. 应用领域
RC-02K821JT 广泛应用于以下领域：
- 消费电子：如智能手机、平板电脑、笔记本电脑等，用于信号处理、电源管理等电路。
- 通信设备：如路由器、交换机、基站等，用于信号调理、滤波等电路。
- 工业控制：如PLC、传感器、电机控制等，用于信号采集、控制电路等。
- 汽车电子：如车载娱乐系统、车身控制模块等，用于信号处理、电源管理等电路。
5. 封装与尺寸
RC-02K821JT 采用0402封装，尺寸为1.0mm x 0.5mm x 0.35mm。这种小型封装非常适合高密度电路板设计，能够有效节省空间，提高电路板的集成度。
6. 可靠性
风华（FH）公司作为知名的电子元器件制造商，其产品以高可靠性和稳定性著称。RC-02K821JT 经过严格的质量控制和测试，确保其在各种应用场景下都能提供稳定的性能。
7. 环境友好
RC-02K821JT 符合RoHS指令，不含有害物质，对环境友好，符合现代电子产品对环保的要求。
8. 总结
RC-02K821JT 是一款高性能的贴片电阻，具有高精度、宽工作温度范围、优异的温度特性和高功率密度等特点。其0402封装适合高密度电路板设计，广泛应用于消费电子、通信设备、工业控制和汽车电子等领域。风华（FH）公司的高品质保证，使得RC-02K821JT 成为工程师在设计电路时的理想选择。
通过以上概述，可以看出RC-02K821JT 在电子电路设计中具有重要的应用价值，能够满足多种复杂电路对电阻的高要求，是现代电子设备中不可或缺的元器件之一。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
