WMSIC Electronic Components

FH CBM100505U102T

ModelCBM100505U102T
Package0402
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FH CBM100505U102T
Type
FH
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
CBM100505U102T
Electronic Component
1
Package
0402
Electronic Component
Ferrite Bead
Electronic Component
±25%
Electronic Component
0.022g
Electronic Component
1
Electronic Component
BM0265105275
Operating Temperature
55℃~+125℃
Current
300mA
@Frequency
1kΩ@100MHz
Resistor(DCR)
650mΩ
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CBM100505U102T 贴片磁珠产品概述

一、产品基本信息

CBM100505U102T是风华(FH)品牌推出的高频噪声抑制元件,属于0402/1005封装贴片磁珠。型号中“100505”对应公制封装尺寸(长1.0mm×宽0.5mm×厚0.5mm),“U102”标识100MHz频率下的典型阻抗为1kΩ,专为小电流信号线路的EMC(电磁兼容)防护设计,适配高密度电路布局需求。

二、核心电性能参数

该磁珠的核心参数围绕高频阻抗特性与直流损耗平衡展开,具体如下:

  1. 阻抗特性:100MHz测试频率下,典型阻抗1kΩ,误差±25%(实际范围750Ω~1250Ω),针对100MHz附近高频噪声优化;
  2. 直流电阻(DCR):650mΩ低直流损耗,减少信号直流分量压降,适合低功耗电路;
  3. 额定电流:持续工作最大电流300mA,超过则可能导致磁芯饱和、阻抗下降或温度超限;
  4. 频率特性:阻抗随频率呈“峰值型”变化,100MHz时阻抗最高,有效抑制该频段共模/差模噪声。

三、物理与封装特性

  1. 封装尺寸:0402(英制)/1005(公制)贴片封装,尺寸紧凑(1.0mm×0.5mm×0.5mm),节省PCB空间;
  2. 封装形式:无引脚SMT封装,兼容回流焊、波峰焊工艺,适配自动化生产,焊接可靠性高;
  3. 材料特性:采用高性能铁氧体磁芯+低电阻合金导线,兼顾高频阻抗与直流损耗,宽温下性能稳定。

四、应用场景说明

基于参数特性,该磁珠适用于以下场景:

  1. 消费电子:手机、平板、智能穿戴的WiFi/蓝牙射频线路,抑制100MHz附近噪声,避免信号干扰;
  2. 通信设备:路由器、交换机的射频前端,减少EMI,符合电磁兼容标准;
  3. 汽车电子:车载导航、ADAS传感器(如毫米波雷达)接口,-55℃~+125℃宽温满足车规要求;
  4. 工业控制:PLC、温度/压力传感器信号线路,抑制工业环境高频干扰,提升信号稳定性。

五、可靠性与环境适应性

  1. 温度范围:-55℃~+125℃,覆盖工业级、车规级环境,极端温度下长期稳定;
  2. 焊接适应性:耐回流焊峰值温度(约260℃,持续≤10秒),无封装开裂风险;
  3. 长期可靠性:风华品牌经过老化测试,额定参数下保证批量一致性与工作寿命。

六、选型与使用注意事项

  1. 频率匹配:仅当噪声频率接近100MHz时,阻抗抑制效果最优,偏离需评估匹配度;
  2. 电流降额:实际工作电流建议≤240mA(额定80%),避免过载衰减;
  3. 布局优化:靠近噪声源/敏感电路,减少PCB走线寄生电感,提升抑制效果;
  4. 焊接工艺:优先回流焊,避免手工焊接局部过热,确保焊接质量。

该产品以紧凑封装、精准阻抗特性与宽温适应性,成为小电流高频噪声抑制的实用选型。

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