Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
FH 0201B221K500NT
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- FH 0201B221K500NT
- Type
- FH
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- 0201B221K500NT
- Electronic Component
- 1
- Electronic Component
- 220pF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.008g
- Electronic Component
- 10
- Electronic Component
- BM0263548225
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：0201B221K500NT 贴片电容 (MLCC)
1. 基本信息
商品名称：0201B221K500NT
商品分类：贴片电容 (MLCC)
封装尺寸：0201
容值：220pF
材料类型：X7R
精度等级：±10%
额定电压：50V
品牌：FH（风华）
2. 贴片电容 (MLCC) 概述
贴片电容，特别是多层陶瓷电容（MLCC），是现代电子电路中广泛使用的一类元器件。这种电容器以其小型化、高性能以及良好的温度稳定性而受到欢迎。0201B221K500NT属于这一类别，它采用0201封装，在体积小的同时，能够提供良好的电气性能。
3. 技术特点
容值与精度：0201B221K500NT的容值为220pF，适合用于高频率、低电压应用场合，尤其是在射频（RF）电路和高频数字电路中。该电容器的±10%的精度，保证了其在实际应用中具有良好的电气特性，能够满足大部分常规电路设计的需求。
温度系数：采用X7R材料，这种陶瓷材料具有相对良好的温度特性，温度范围在-55°C至+125°C内，电容值变化率在±15%之内。因此，在环境温度变化较大的应用场景中，其性能稳定，能够确保电路的可靠运行。
额定电压：该电容的额定电压为50V，适合在各种电压等级的电路中使用，特别是在低电压电子设备中，能够有效抑制高频噪声，提升信号清晰度和电路整体性能。
4. 应用场景
贴片电容0201B221K500NT适用于众多应用场景，包括但不限于：
- 射频（RF）电路：在无线通信设备、移动电话和其他射频应用中，进行滤波和耦合，提升信号质量。
- 滤波电路：在电源管理、信号处理等电路中，用于降低高频噪声，维持信号的稳定性。
- 信号耦合：在模拟和数字电路中，提供良好的耦合能力，确保信号的准确传输和完整性。
- 低噪声放大器：用作预放大级中的旁路电容，以保持放大器的稳定性和噪声性能。
5. 安装与制造要求
由于0201B221K500NT的体积较小，安装时需注意以下几点：
- 焊接方式：通常采用回流焊或波峰焊，确保其焊点清晰，避免出现短路或焊接不良。
- 储存条件：应存放在干燥、无尘环境中，避免潮湿和高温，以防影响电容器性能。
- 电路板设计：在设计PCB layout时需要充分考虑电容的引线长度和布局，以减少电感对高频性能的影响。
6. 结论
0201B221K500NT是一款性能优越的贴片电容器，适合用于多种电子应用。在小型化和高效能的现代电子产品中，它凭借其出色的电气特性、良好的温度稳定性和适用的额定电压，成为电路设计师的热门选择。选择FH（风华）品牌的此款产品，将是确保您设计高度可靠电路的理想方案。无论是在通信设备、消费电子、还是工业自动化领域，0221B221K500NT都能发挥其关键作用，提高整体电子产品的性能和可靠性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
