WMSIC Electronic Components

FH RC-02K822JT

ModelRC-02K822JT
Package0402
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FH RC-02K822JT
Type
FH
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
RC-02K822JT
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.009g
Electronic Component
8.2kΩ
Electronic Component
50
Electronic Component
BM0265104824
Operating Temperature
55℃~+155℃
Electronic Component
±100ppm/℃
Resistor Type
Resistor
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

风华RC-02K822JT厚膜贴片电阻产品概述

RC-02K822JT是风华电子(FH) 推出的一款0402封装厚膜贴片电阻,针对小型化、低功耗电子设备的电路设计需求开发,兼具宽温稳定性与成本优势,是消费电子、汽车电子及工业控制等领域的常规选型元件。

一、产品基本定位与核心特征

RC-02K822JT属于厚膜贴片电阻系列,核心定位为小封装通用型电阻,重点满足以下设计需求:

  1. 小型化电路集成:0402封装(1.0mm×0.5mm公制尺寸)适配高密度PCB布局,降低设备体积;
  2. 宽温环境稳定:支持-55℃~+155℃极端温度范围,覆盖汽车低温启动、工业高温等场景;
  3. 通用精度与功率:±5%阻值精度覆盖多数非超高精度电路,62.5mW额定功率适配低功耗应用;
  4. 厚膜工艺优势:采用厚膜印刷工艺,兼顾成本与可靠性,抗机械应力、环境腐蚀能力优于部分薄膜电阻。

二、关键电气参数详解

RC-02K822JT的电气参数针对通用电路优化,核心参数如下:

1. 阻值与精度

  • 标称阻值:8.2kΩ(符合E24标准阻值系列,便于电路选型与批量采购);
  • 精度等级:±5%(满足消费电子、工业控制等场景的阻值误差要求,无需额外校准)。

2. 功率与功率密度

  • 额定功率:62.5mW(0402封装下的常规功率等级,适合低功耗电路中的分压、上拉/下拉、信号调理等应用);
  • 功率密度:约125mW/mm²(小封装下实现较高功率密度,适配紧凑电路设计)。

3. 温度系数(TCR)

  • 温度系数:±100ppm/℃(表示温度每变化1℃,阻值变化百万分之一百);
  • 宽温稳定性:在-55℃~+155℃范围内,最大阻值变化量约为8.2kΩ×100ppm/℃×210℃=172.2Ω,变化率约2.1%,满足宽温场景下的电路性能一致性。

三、物理封装与环境适应性

1. 封装规格

  • 封装形式:0402(英制代码,对应公制1.0mm×0.5mm尺寸);
  • 焊接兼容性:SMD贴片引脚适配回流焊、波峰焊等常规工艺,焊接可靠性符合IPC-A-610标准。

2. 环境适应性

  • 工作温度:-55℃~+155℃(覆盖汽车电子、工业控制等极端温度场景);
  • 湿度耐受:符合IEC 60068-2-66标准,可在90%~95%相对湿度下长期工作;
  • 机械应力:耐振动(10~2000Hz,1g加速度)、抗冲击(50g峰值加速度),满足车载、手持设备的振动要求。

四、典型应用场景

RC-02K822JT的参数适配多领域通用电路,典型应用包括:

  1. 消费电子:智能手机、平板电脑的信号滤波、按键上拉/下拉电阻;
  2. 汽车电子:车载传感器(温度、压力)信号调理、仪表盘辅助电路;
  3. 工业控制:小型PLC I/O接口、传感器信号分压电路;
  4. 物联网终端:低功耗传感器节点电压基准分压、无线模块匹配电阻;
  5. 电源电路:小功率DC-DC反馈分压、LED指示灯限流电阻。

五、品牌与品质保障

风华电子(FH)作为国内被动元件龙头,RC-02K822JT的品质保障体现在:

  1. 工艺成熟度:厚膜电阻生产工艺超20年,产品一致性控制稳定;
  2. 环保合规:符合RoHS 2.0、REACH标准,无铅焊接兼容;
  3. 可靠性测试:通过155℃×1000h高温老化、-55℃~+155℃×500次温度循环测试,失效率低于0.1%/1000h;
  4. 供货稳定:年产能充足,批量订单交货周期1~2周,小批量现货支持。

总结:RC-02K822JT是一款性价比突出的通用型厚膜贴片电阻,小封装、宽温稳定、基础精度适配多数电子设备,是工程选型中优先考虑的常规元件之一。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.