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FH RC-02K3833FT
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FH RC-02K3833FT
- Type
- FH
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- RC-02K3833FT
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.011g
- Electronic Component
- 383kΩ
- Electronic Component
- 50
- Electronic Component
- BM0265104812
- Operating Temperature
- 55℃~+155℃
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
风华FH RC-02K3833FT厚膜片式电阻产品概述
一、产品定位与典型应用场景
RC-02K3833FT是风华电子推出的0402封装厚膜片式电阻，主打小型化、高性价比、宽温适应性，主要面向对空间敏感、低功耗的电子设备，典型应用场景包括：
- 消费电子：智能手机/智能手表的电源滤波、信号分压电路；
- 物联网终端：低功耗传感器模块、无线蓝牙/WiFi模块的偏置电阻；
- 小型医疗设备：便携式血糖仪、血氧仪的信号调理电路；
- 汽车电子：车载小功率控制单元（如后视镜调节、氛围灯）的辅助电路（适配-55℃~155℃宽温）；
- 工业控制：小型PLC的输入输出接口电阻、低压传感器信号链。
二、核心参数详解
该电阻的关键参数均针对通用电路需求优化，具体如下：
参数 详情与实际意义 阻值与代码 标称阻值383kΩ，采用E24系列代码“3833”（前3位为有效数字，第4位为10³倍，即383×10³=383kΩ） 精度等级 ±1%（J级），满足大多数通用电路的精度需求，无需承担高精度电阻的额外成本 额定功率 62.5mW（0.0625W），是0402封装厚膜电阻的典型功率等级，适配低功耗电路 温度系数（TCR） ±100ppm/℃，表示温度每变化1℃，阻值漂移±0.01%；155℃时相对于25℃基准，漂移约±1.3% 工作温度范围 -55℃~+155℃，覆盖工业级与汽车级部分场景，耐高低温性能优于商业级电阻 封装尺寸 0402（英制0.04″×0.02″，公制1005），体积约1.0mm×0.5mm，适合高密度PCB设计三、封装与工艺优势
- 封装可靠性：采用陶瓷基片+厚膜电阻膜+金属电极结构，电极与基片结合力强，耐焊接热冲击（符合J-STD-020标准）；
- 厚膜工艺特点：风华自主研发的印刷/烧结工艺，电阻膜层均匀性好，批量生产时阻值离散度≤±0.5%（优于行业平均）；
- 环保与合规：符合RoHS 2.0、REACH指令，无铅无卤，适配全球市场需求。
四、品牌与品质保障
风华（FH）是国内电子元器件行业老牌厂商，拥有30+年电阻生产经验，厚膜电阻产品线覆盖0201~2512全封装。RC-02K3833FT通过：
- ISO 9001质量管理体系认证；
- 部分批次支持AEC-Q200汽车级认证（需确认具体批次）；
- 老化测试（1000小时高温存储）后阻值变化≤±0.2%，长期稳定性可靠。
五、选型与应用注意事项
- 功率降额：实际工作功率建议≤额定值的70%（即≤43.75mW），避免长期过载导致阻值漂移；
- 温度补偿：高温环境（如155℃）下，需考虑TCR带来的漂移，若精度要求≥±1%，建议增加温度补偿电路；
- 焊接规范：回流焊峰值温度≤260℃（持续≤10秒），波峰焊温度≤245℃（持续≤5秒），避免过热损坏膜层；
- 存储要求：未开封产品存储于0~35℃、湿度≤60%环境，开封后建议12个月内用完，避免受潮影响焊接性。
该产品凭借小型化、稳定性能与高性价比，成为0402封装厚膜电阻的主流选择之一，适用于中低端到中端电子设备的量产设计。
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