WMSIC Electronic Components

FH 0402CG3R0B500NT

Model0402CG3R0B500NT
Package0402
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

17 specifications

Core information

Product name
FH 0402CG3R0B500NT
Type
FH
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
0402CG3R0B500NT
Electronic Component
1
Electronic Component
3pF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
0.022g
Electronic Component
1
Electronic Component
BM0265420070
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0402CG3R0B500NT 多层陶瓷贴片电容(MLCC)产品概述

一、产品基本属性

该产品为风华高科(FH)推出的多层陶瓷贴片电容(MLCC),核心基础参数明确,是小型化精密电路的常用选型:

  • 品牌与类型:风华高科,多层陶瓷贴片电容(MLCC)
  • 封装规格:0402(英制,对应公制1005),典型尺寸:长度1.0±0.02mm、宽度0.5±0.02mm、厚度0.2±0.03mm
  • 容值参数:3pF,精度±0.1pF(C0G类小容值典型精度)
  • 额定电压:50V DC(直流额定电压,交流峰值需降额)
  • 温度特性:C0G(国际标准NP0),温度系数±30ppm/℃,工作温域-55℃~125℃
  • 损耗特性:1kHz下损耗角正切值(tanδ)≤0.1%,高频(1GHz)下保持低损耗

二、核心性能特点

该产品针对精密高频场景设计,核心优势集中在温度稳定性、高频性能与小型化:

  1. 宽温域容值稳定:C0G温度系数保证-55℃~125℃范围内容值偏差≤0.1%,避免电路参数漂移(如射频振荡器频率偏移)
  2. 高频低损耗高Q值:1GHz下Q值可达100以上,减少信号能量损耗,适配射频、微波电路
  3. 小型化高密度适配:0402封装体积仅为0.5mm²左右,满足智能穿戴、蓝牙耳机等高密度PCB设计
  4. 高可靠性耐焊接:通过260℃回流焊3次无失效测试,电极与介质层结合紧密,降低短路/开路风险
  5. 环保合规:无铅无卤,通过RoHS 2.0、REACH SVHC认证,适配全球市场准入

三、典型应用场景

该产品因小容值、高稳定、低损耗特性,广泛用于以下领域:

  1. 射频通信设备:手机射频前端(PA滤波、天线匹配)、基站收发模块谐振电路、蓝牙/WiFi模块信号滤波
  2. 精密测试仪器:示波器垂直通道补偿电容、信号发生器频率稳定电容,确保输出信号精度
  3. 消费电子终端:智能手表、TWS耳机无线充电接收端滤波、传感器模块信号耦合
  4. 工业控制设备:PLC模拟量输入滤波、工业传感器抗干扰电容,适应-40℃~85℃工业环境
  5. 汽车电子(商业级):车载蓝牙、导航系统辅助滤波(需确认具体场景温度要求)

四、选型与替换参考

替换时需优先匹配封装、温度系数、容值精度、额定电压,避免影响电路性能:

  1. 同参数替代型号:
    • 村田:GRM1555C1H3R0BA01D(0402、3pF±0.1pF、50V、C0G)
    • 三星:CL05B3R0CB5NNNC(0402、3pF±0.1pF、50V、C0G)
    • TDK:C1005C0G3R0B500T(0402、3pF±0.1pF、50V、C0G)
  2. 降额原则:实际工作电压建议≤35V DC(降额70%),交流峰值电压≤25V,延长产品寿命
  3. 精度适配:若电路对精度要求不高(±0.25pF),可选择同参数低精度型号,但需评估对电路的影响

五、质量与可靠性保障

风华高科针对该产品建立了完善的质量管控体系:

  1. 生产工艺:采用高精度叠层印刷、低温烧结工艺,介质层厚度均匀(公差≤±0.5μm),电极连续性好
  2. 测试认证:每批次通过全参数测试(容值、损耗、耐压、绝缘电阻),符合IEC 60384-1、GB/T 2693-2001标准
  3. 寿命预期:额定条件下MTBF(平均无故障时间)≥10⁶小时,降额使用可进一步提升
  4. 存储要求:存储环境温度0℃~40℃、相对湿度≤60%,避免阳光直射与化学腐蚀,存储期≤12个月

该产品凭借稳定的性能与小型化优势,成为精密电子、射频通信领域的主流选型之一,可满足多数商业级与工业级场景的设计需求。

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