Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
FH VHF100505HQ3N0ST
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FH VHF100505HQ3N0ST
- Type
- FH
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- VHF100505HQ3N0ST
- Electronic Component
- 1
- Package
- 0402
- Type
- Inductor; Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- 0.022g
- Inductor
- 3nH
- Electronic Component
- 1
- Factor
- 8@100MHz
- Electronic Component
- BM0230633543
- Current
- 800mA
- Frequency
- 6GHz
- Resistor(DCR)
- 130mΩ
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
VHF100505HQ3N0ST 产品概述
一、产品简介
VHF100505HQ3N0ST 是风华（FH）系列面向射频/高频应用的叠层贴片电感，标称电感值 3.0 nH，采用 0402（1005公制）封装。该器件针对高频链路的阻抗匹配、射频滤波及共模/差模抑制等场景优化设计，具有较高自谐振频率与稳定的频率响应，适合空间受限且需高频性能的电路板应用。
二、主要电气参数
- 电感值：3.0 nH（标称）
- 额定电流：典型 800 mA（注意市面同类品规格存在差异，有时可能标注为 300 mA，请以出货数据表为准）
- 直流电阻（DCR）：典型 130 mΩ（亦有资料列出 200 mΩ 的版本）
- 品质因数（Q）：8 @ 100 MHz
- 自谐振频率（SRF）：约 6 GHz
- 类型：叠层高频贴片电感
- 封装：0402（1005）
三、主要特性与优势
- 高频性能优越：SRF 高达约 6 GHz，适用于 VHF/UHF 及更高频段的阻抗调谐和滤波。
- 小型化：0402 封装便于高密度 PCB 布局，适合移动设备和小型模块。
- 良好的 Q 值：在 100 MHz 附近 Q ≈ 8，可在射频回路中保持较低损耗。
- 可承载中等电流：典型可承载至数百毫安至近安级别（具体以器件出厂数据为准），兼顾信号完整性与功率需求。
四、典型应用场景
- 射频前端：匹配网络、谐振回路与带通/带阻滤波器
- 射频收发器与无线模块（蓝牙、Wi‑Fi、WLAN、LoRa 等）
- 高频阻抗匹配与去耦
- EMI 抑制与共模/差模滤波（与其他无源元件配合）
五、设计与使用建议
- 布局：靠近射频器件放置以减少寄生走线，保持信号路径短且对称。
- 温升与电流：在高电流或连续工作时应考虑电阻发热，必要时选择更低 DCR 或更大封装元件。
- 阻抗影响：在高频下电感与寄生电容共同决定频率响应，实际设计需在目标频段做测量验证并根据 PCB 寄生进行调整。
- 焊接工艺：遵循厂家推荐的回流曲线，避免过高温和过长焊接时间导致电感性能变化。
六、可靠性与采购说明
- 可靠性：叠层工艺与陶瓷基底提供良好的热稳定性和机械强度，但在振动、冲击及过温条件下仍需按应用场景评估寿命。
- 规格核对：由于市场上存在同电感值但 DCR、额定电流不同的近似型号，采购前请以供货商的最新数据表（D/S）为准，核对封装、温升、频率响应及可靠性要求。
- 订购信息：型号 VHF100505HQ3N0ST 通常以卷带包装供应，适配自动贴片生产线，批量采购可咨询风华或授权代理以获取完整技术支持与检验报告。
如需该型号的完整数据手册（包含 S 参数、频率响应曲线、温度系数和回流焊推荐曲线），我可以帮您整理或对比同系列其它电感，以便在具体设计中选择最合适的器件。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
