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FH 0201B222K500NT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- FH 0201B222K500NT
- Type
- FH
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- 0201B222K500NT
- Electronic Component
- 1
- Electronic Component
- 2.2nF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.008g
- Electronic Component
- 10
- Electronic Component
- BM0257366831
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FH（风华）0201B222K500NT 产品概述
一、产品简介
FH 0201B222K500NT 为风华系列贴片多层陶瓷电容（MLCC），额定电容为 2.2nF（222），初始容差 ±10%（K），额定直流电压 50V（500），介质为 X7R，超小型 0201 封装，适用于高密度 SMT 应用场景，兼顾体积最小化与电气性能。
二、主要特性
- 介质 X7R：工作温度范围广（-55°C 至 +125°C），温度特性优良，温度漂移在 X7R 规范范围内。
- 体积小：0201 封装便于实现 PCB 高度集成与微型化设计（不同厂商 0201 尺寸存在微小差异）。
- 良好电气性能：低串联电阻与电感，适合去耦、滤波与旁路等用途。
- 工艺兼容：适配常规回流焊工艺，适合自动贴装与批量生产。
三、电气注意点
- 初始容差为 ±10%，实际工作时容值受温度与直流偏压影响，X7R 在高直流偏压下会出现明显容值下降，设计时应参考厂商 DC-bias 曲线。
- 工作频率范围内表现稳定，但对于高频或射频应用需注意寄生电感与 ESR 的影响。
- 额定电压 50V，超过该值会加速击穿失效，不建议长期在接近或超过额定电压的条件下使用。
四、典型应用
- 移动与可穿戴设备的去耦与滤波；
- 高密度消费类与工业电子产品的旁路、耦合与谐振回路；
- IoT 终端、传感器模块、微型功率管理电路中的滤波器件。
五、选型与设计建议
- 若电路中存在持续较高 DC 偏压，应选择更大容量或更高介质稳定性的电容，或参考厂商 DC-bias 测试曲线进行裕量设计；
- 在高应力机械环境（弯曲、冲击）避免将 0201 电容置于板边或紧邻较深的通孔处，以减少裂纹风险；
- 对于关键滤波节点，可并联多片不同容量或封装的电容以覆盖宽频带特性。
六、封装、焊接与储存
- 采用常规 SMT 回流焊工艺，遵循厂商推荐温度曲线；
- 贴片与回流后避免对焊点施加局部机械应力；
- 储存于干燥环境，超长期保存建议按厂商要求进行干燥处理或及时使用。
七、可靠性与合规
FH 产品通过常规行业可靠性试验（高温、湿热、热冲击、焊接可焊性等），满足表面贴装陶瓷电容的使用与可靠性要求。具体性能指标与测试数据建议参考风华出具的产品规格书与 DC-bias、老化、寿命等曲线图。
如需更详尽的尺寸图、回流曲线、DC-bias 曲线或可靠性报告，可提供样品编号或联系供应商获取原厂资料。
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