Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
FH 0805CG270J500NT
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- FH 0805CG270J500NT
- Type
- FH
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- 0805CG270J500NT
- Electronic Component
- 1
- Electronic Component
- 27pF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.027g
- Electronic Component
- 1
- Electronic Component
- BM0257367091
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：0805CG270J500NT 贴片电容（MLCC）
一、产品简介
0805CG270J500NT 是一款由著名电子元器件制造商风华（FH）生产的贴片电容，属于多层陶瓷电容（MLCC），其封装尺寸为0805。该电容具有优异的电性能和稳定的温度特性，适用于各种电子电路设计。其主要参数包括：电容值为27pF，额定电压为50V，温度系数为C0G（或NP0），精度为±5%。
二、产品特性
电容值: 27pF
- 适用于高频电路和滤波器设计。
- 精确的电容值确保了电路的谐振特性和稳定性，适合用于RF（射频）和微波应用。
温度系数: C0G（NP0）
- 该类型的温度系数意味着电容在较宽的温度范围内具有极低的变化率，适合高稳定性要求的应用。
- 温度变化时，电容的电容值基本保持不变，提供了优越的线性度和可靠性。
额定电压: 50V
- 额定电压是电容器在正常工作条件下所能承受的最大电压。50V的额定电压使得该电容能在多数中低压电子电路中广泛应用。
- 在高压环境下，额定电压的余量能增加其可靠性和使用寿命。
精度: ±5%
- 精度指电容值的公差范围。±5%的公差为常用级别，适合大多数一般应用，平衡了性能和成本。
封装尺寸: 0805
- 0805封装尺寸（2.0mm x 1.25mm）使得产品适合于高密度表面贴装技术（SMT）和空间有限的电路设计。
- 适用于自动化贴装设备，降低了生产制造成本和组装难度。
三、应用场景
0805CG270J500NT 贴片电容广泛应用于各种电子设备，主要包括：
消费电子产品
- 用于智能手机、平板电脑、电视和音响等设备中的滤波、耦合和旁路功能。
通信设备
- 在射频电路及基站设备中，作为谐振电路的关键元件，确保信号的清晰度和稳定性。
计算机与周边设备
- 在计算机主板、显卡及外部设备中，担任信号处理及电源滤波的角色，提升设备的抗干扰能力。
汽车电子
- 随着汽车智能化的发展，该元件在汽车控制单元（ECU）及信息娱乐系统中也得到了越来越多的应用。
四、产品优势
- 高稳定性: 由于采用C0G材料，这款电容器在电压、温度等变化条件下展现出较高的稳定性能。
- 小型化设计: 0805的封装设计使得产品在空间有限的配置中依然能够达到高性能。
- 适应性强: 在多个电路设计和应用中均表现出色，为设计工程师在选择元器件时提供了更好的灵活性。
五、总结
0805CG270J500NT 贴片电容凭借其高精度、稳定性和优良的电性能，成为电子产品设计中的重要元件之一。无论是在提高清晰度的信号传输、降低噪声干扰，还是在节省空间、提升效率方面，都展现出了良好的应用价值。随着电子产品对性能及可靠性要求的不断提升，此款电容器也必将在未来的电子领域中发挥更加重要的作用。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
