Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RC-02K3402FT是风华电子(FH)推出的一款小功率高精度厚膜贴片电阻,针对紧凑型电路设计需求优化,兼顾阻值精度、宽温稳定性与空间利用率,广泛适配消费电子、工业控制等多领域应用。
该电阻属于风华厚膜贴片电阻系列,型号命名逻辑清晰:
其定位为低功耗高精度基础元件,核心解决小型化电路中“阻值准、温漂小、占空间少”的矛盾,是替代传统插件电阻的主流选择。
阻值为34kΩ,精度±1%——满足99%以上工业与消费电子场景的偏差控制要求(如分压电路的比例准确性、信号放大的增益稳定性),无需额外校准即可直接装机。
额定功率62.5mW(1/16W),符合0402封装的典型功率上限,适配低功耗电路(如电池供电设备、传感器前端)。实际使用时建议按80%降额(即≤50mW),可有效延长寿命、避免过热。
温度系数为**±100ppm/℃**,即温度每变化1℃,阻值变化量不超过34kΩ×100×10⁻⁶=3.4Ω。在-55℃~+155℃宽温区内,最大阻值漂移量为3.4Ω×210℃=714Ω,结合±1%精度,实际有效阻值范围仍控制在34kΩ±3.1%内,满足宽温环境下的性能稳定性。
工作温度覆盖**-55℃至+155℃**,远超民用级(0℃~70℃)标准,可适配:
低温下无阻值突变,高温下功率降额特性符合IEC 60115-1标准。
采用丝网印刷+高温烧结工艺,电阻膜层与陶瓷基片结合牢固,具备:
符合RoHS 2.0、REACH等环保标准,无铅无镉;部分批次通过AEC-Q200(汽车电子级)认证,可直接用于车规级应用。
采用0402封装(英制:0.04″×0.02″;公制:1.0mm×0.5mm),是目前最小的贴片电阻封装之一,适配高密度PCB设计(如智能手机主板、小型通信模块),单块PCB可集成数千个该电阻,有效节省空间。
风华电子(FH)是国内电子元器件龙头企业,拥有30余年厚膜电阻研发生产经验,产能覆盖全球,产品通过ISO 9001、ISO 14001等体系认证。RC-02K3402FT作为其成熟产品线,具备:
该电阻以“高精度、宽温稳、小体积”为核心优势,是小型化电路设计中提升性能与集成度的理想选择,可有效降低系统成本与空间占用。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products