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FH 0201CG470J500NT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- FH 0201CG470J500NT
- Type
- FH
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- 0201CG470J500NT
- Electronic Component
- 1
- Electronic Component
- 47pF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.008g
- Electronic Component
- 10
- Electronic Component
- BM0263548090
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
风华FH 0201CG470J500NT MLCC产品概述
一、产品基本信息
该产品为风华电子（FH） 生产的贴片多层陶瓷电容（MLCC），型号0201CG470J500NT，定位为小型化高频/精密电路用稳定电容，适配高密度电子设备的小型化设计需求。
二、核心参数详解
参数项 具体指标 备注说明 容值 47pF 型号“470”表示47×10⁰ pF 精度 ±5% 型号“J”为IEC精度代码（J档） 额定电压 50V DC 型号“500”表示50×10⁰ V 温度系数 C0G（NP0类） 温度稳定性最优的陶瓷电容类别 封装 0201（英制）/ 0402（公制） 超小型贴片封装三、封装与尺寸规格
0201封装为当前电子设备主流的超小型封装之一，风华标准尺寸如下：
- 长度（L）：0.60±0.03mm
- 宽度（W）：0.30±0.03mm
- 厚度（T）：0.30±0.03mm
- 端电极结构：镍（Ni）底层+锡（Sn）表层，符合无铅环保要求，焊接附着力强，耐回流焊冲击。
四、C0G温度特性核心优势
C0G（NP0）是陶瓷电容中温度稳定性、频率特性最优的类别，核心优势体现在：
- 宽温容值稳定：在-55℃~125℃工作区间内，容值变化率≤±0.3%（远低于X7R的±15%、Y5V的±20%）；
- 低高频损耗：1kHz/25℃下介质损耗角正切值（tanδ）≤0.001，适合射频振荡、滤波电路；
- 无老化效应：容值随时间变化可忽略，长期使用可靠性高。
五、典型应用场景
因小型化、高稳定特性，该电容广泛用于：
- 射频通信：5G基站、手机、WiFi模块的射频滤波、耦合电路；
- 精密仪器：示波器、信号发生器的时钟振荡、基准电压电路；
- 汽车电子：车载传感器信号处理、辅助电路（适配-40℃~125℃宽温）；
- 消费电子：智能穿戴、平板电脑的射频模块、电源低噪声滤波；
- 工业控制：PLC、伺服驱动器的抗干扰滤波电路。
六、可靠性与质量保障
风华作为国内MLCC龙头企业，该产品满足：
- 环保合规：RoHS 2.0、REACH无铅无卤认证；
- 可靠性测试：通过高低温循环（-55℃~125℃，1000次）、湿热测试（85℃/85%RH，1000h）、焊接热冲击测试；
- 批量一致性：批量生产容值/精度偏差控制在规格范围内，适合规模化贴片生产。
七、选型与使用注意事项
- 电压匹配：电路工作电压需低于50V DC，建议留30%余量（如实际工作电压≤35V）；
- 精度升级：若需±1%高精度，可替换为F档型号（0201CG470F500NT）；
- 焊接工艺：推荐回流焊（温度曲线：预热150-180℃/60-120s，峰值230-260℃/10-30s）；手工焊需控制烙铁温度≤350℃，焊接时间≤3s；
- 存储条件：常温干燥环境（25±5℃，湿度≤60%RH），避免长期暴露于潮湿环境。
该产品凭借小型化、高稳定、高可靠性，成为高频精密电路的优选MLCC之一，适配多领域电子设备的升级需求。
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