WMSIC Electronic Components

FH VHF100505HQ1N5BT

ModelVHF100505HQ1N5BT
Package0402
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FH VHF100505HQ1N5BT
Type
FH
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
VHF100505HQ1N5BT
Electronic Component
1
Package
0402
Type
Inductor; Inductor
Electronic Component
SMD Inductor
Electronic Component
0.022g
Inductor
1.5nH
Electronic Component
1
Factor
8@100MHz
Electronic Component
BM0259731940
Current
1A
Frequency
6GHz
Resistor(DCR)
80mΩ
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

VHF100505HQ1N5BT — FH(风华) 0402 高频叠层贴片电感 1.5nH 产品概述

一、产品简介

VHF100505HQ1N5BT 为风华(FH)系列高频叠层贴片电感,封装规格为0402(1005公制,约1.0×0.5mm)。该器件针对射频及高速信号应用优化,体积小、频率响应宽、适配表面贴装工艺,是移动终端、无线通信及高频电路中常用的无源元件之一。

二、主要性能参数

  • 电感值:1.5 nH
  • 额定电流:1 A(直流电流)
  • 直流电阻(DCR):≈80 mΩ
  • 品质因数(Q):8 @ 100 MHz
  • 自谐振频率(SRF):6 GHz
  • 类型:叠层电感 / 高频电感
  • 封装:0402 贴片

三、产品特点

  • 高频性能优良:自谐振频率高达6 GHz,可在VHF/UHF以至微波前端电路中使用。
  • 小尺寸、低剖面:0402封装利于高密度PCB布局与轻薄化设计。
  • 工艺稳定:叠层结构提供稳定的电感值与一致性,适配自动贴片与回流焊工艺。
  • 综合损耗可控:DCR与Q值在小型封装中取得平衡,适合匹配网络与射频去耦等场合。

四、典型应用

  • 无线通信射频匹配网络(天线匹配、输入输出匹配)
  • 高频滤波器、谐振回路与阻抗变换电路
  • 射频放大器偏置网络与旁路滤波
  • 高频去耦与共模/差模噪声抑制(视具体电路拓扑)
  • 其他需要小电感值且占板面积受限的高速信号场合

五、封装与焊接建议

  • 标准贴片回流焊工艺兼容。建议参考风华的回流温度曲线与PCB焊盘设计指南以保证可靠焊接。
  • 由于0402体积小,焊盘与焊膏印刷需控制良好以避免桥连或空焊。
  • 推荐在PCB布局时为电感预留适当热阻与机械支撑,避免焊接或后工序中的机械应力导致封装裂纹。

六、选型与注意事项

  • 当工作频率接近或超过SRF时,电感表现会发生明显变化,务必在目标频段测试真实电路的S参数或阻抗。
  • 1 A的额定电流与80 mΩ的DCR决定了在直流偏置或大电流通过时会有功耗与温升,应评估热预算。
  • 若对Q值有更高要求或需要更低损耗,应考虑更大封装或专用高Q器件。
  • 生产验收建议测量电感值、DCR及在目标频段的S11/S21以确认批次一致性。

七、储存与可靠性

  • 常温干燥环境下保存,避免潮湿与强酸碱气体环境。
  • 出货后建议在规定时效内使用,若受潮需进行烘烤处理以防焊接缺陷。
  • 适用于要求长期可靠性的消费电子与通信设备,但建议在关键应用进行加速寿命与环境应力验证。

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