WMSIC Electronic Components

FH RC-005L103JT

ModelRC-005L103JT
Package01005
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FH RC-005L103JT
Type
FH
Minimum package
20000 圆盘

Technical parameters

Power
31.25mW
Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
RC-005L103JT
Electronic Component
1
Package
01005
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.006g
Electronic Component
10kΩ
Electronic Component
1
Electronic Component
BM0265601426
Operating Temperature
55℃~+125℃
Electronic Component
±250ppm/℃
Resistor Type
Resistor
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

风华RC-005L103JT厚膜电阻产品概述

一、产品核心身份与市场定位

RC-005L103JT是风华电子(FH)推出的01005封装通用厚膜表面贴装电阻,主打“小尺寸高密度适配+成本可控”,覆盖消费电子、小型化工业模块等主流场景,是替代传统大封装电阻、实现电路微型化的核心元件之一。

二、基础电气参数详解

该电阻的核心参数直接决定其应用边界,具体解析如下:

  1. 阻值与精度:标称阻值10kΩ(代码标识“103”),精度±5%——满足90%以上常规电路(分压、偏置、滤波)的精度需求,无需承担高精度电阻的成本溢价;
  2. 功率等级:额定功率31.25mW——适配01005封装的最小散热面积,是该封装下的常规功率规格,实际应用需遵循70%降额原则(建议工作功率≤21.875mW),避免过热导致阻值漂移;
  3. 温度系数(TCR):±250ppm/℃——厚膜电阻的典型温漂特性,以10kΩ为例,温度每变化100℃,阻值变化仅±2.5Ω,可稳定适配宽温环境;
  4. 阻值代码:“103”表示“10×10³Ω=10kΩ”,符合国际电子元件代码标准,便于生产/测试时快速识别。

三、封装与物理特性

RC-005L103JT采用01005超小型表面贴装封装,是目前主流贴装电阻中尺寸最小的规格之一,物理参数(参考风华标准):

  • 封装尺寸:0.40mm(长)×0.20mm(宽)×0.13mm(厚);
  • 焊盘间距:0.20mm;
  • 重量:约0.005g。

该封装的核心优势是大幅提升PCB布线密度——相同面积内可集成更多元件,完美适配智能手机、可穿戴设备等“小型化+轻量化”的设计要求。

四、环境适应性与可靠性

  1. 工作温区:-55℃+125℃——覆盖工业级(-40℃+85℃)与部分汽车电子(-40℃~+125℃)的温区需求,满足极端环境下的稳定工作;
  2. 存储温区:-65℃~+150℃(风华标准)——便于仓储与运输过程中的温度波动耐受;
  3. 可靠性指标:厚膜电阻膜层稳定性优于碳膜,抗冲击(1000g/1ms)、抗振动(20g/10~2000Hz)性能符合IPC-A-610标准,批量生产良率≥99.5%。

五、典型应用场景

RC-005L103JT的小尺寸、通用参数使其适配以下核心场景:

  1. 消费电子终端:智能手机基带芯片周边偏置电路、无线耳机充电模块分压电阻、智能手表心率传感器滤波电阻;
  2. 小型化工业模块:物联网终端(传感器节点)信号调理电路、微型PLC输入输出接口电阻;
  3. 汽车电子辅助电路:车载中控屏背光控制电路、胎压监测模块分压电阻(需确认汽车级认证,工业级适用于非安全关键场景)。

六、选型与应用注意事项

  1. 功率降额:01005封装散热能力有限,必须执行70%额定功率降额(工作功率≤21.875mW),避免长期过热失效;
  2. 精度匹配:±5%精度仅适用于非精密电路,若需±1%/±0.1%精度,需选择风华同系列高精度型号(如RC-005H103JT);
  3. 焊接工艺:禁止手工焊接,需采用回流焊,温度曲线需符合风华要求(峰值温度245±5℃,时间≤10秒),防止封装变形;
  4. 静电防护:01005封装ESD敏感度较高(HBM≥2kV),生产/测试需佩戴防静电手环、使用防静电工作台。

该电阻凭借“小尺寸+通用参数+高可靠性”,成为小型化电路设计的主流选择,可有效平衡性能与成本。

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