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FH 0805B472K500NT
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- FH 0805B472K500NT
- Type
- FH
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- 0805B472K500NT
- Electronic Component
- 1
- Electronic Component
- 4.7nF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.027g
- Electronic Component
- 1
- Electronic Component
- BM0257641649
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：0805B472K500NT
一、产品简介
0805B472K500NT是一款高性能的贴片电容器（MLCC），具有50V的额定电压和±10%的容量公差，容量值为4.7nF。其采用了0805封装，符合表面贴装（SMD）技术，适合于现代电子设备中的各种应用。产品所采用的X7R材料类型使其在宽温度范围内保持良好的电性能，广泛应用于滤波、去耦和耦合等电路。
二、技术规格
- 品牌: FH（风华）
- 封装类型: SMD0805
- 额定电压: 50V
- 容量: 4.7nF
- 容量公差: ±10%
- 材料类型: X7R（温度系数）
- 工作温度范围: -55°C 至 +125°C
三、材料特性
X7R介质材料是一种陶瓷电容器的材料，它在电容值和温度之间有较好的线性关系。具体来说，X7R电容器在温度变化时的电容值变化通常在±15%以内。这一特性使得0805B472K500NT在各种环境条件下都能保持相对稳定的电气性能，适用于需要高精度和稳定性的电路设计中。
四、封装参数
0805（也称为2012 Metric）封装尺寸为2.0mm x 1.25mm，适合于多种表面贴装设备，使得其在PCB（印刷电路板）上占用的空间相对较小。这种封装形式便于自动化贴装，提高了生产效率和设计的灵活性，是现代电子产品设计中非常流行的选择。
五、应用领域
0805B472K500NT广泛应用于以下领域：
- 消费电子产品：用于手机、平板电脑、电视、计算机等设备的电源去耦，确保设备在运作中保持稳定。
- 工业设备：在各种工业自动化系统、传感器和电气控制装置中提供滤波和耦合功能。
- 通信设备：用于基站、路由器等通信设备中，在信號传输过程中消除噪声，提高信号质量。
- 汽车电子：汽车电子管理系统中用于电源管理和噪声滤除，提升车载设备的可靠性。
六、性能优势
- 高稳定性：由于其使用的X7R材料，0805B472K500NT能够在各种工作温度和电压条件下保持稳定的电性能，确保电路的可靠运行。
- 小型化设计：0805封装使其在设计中满足小型化和轻量化的需求，为紧凑的电子设备提供了更多的设计自由度。
- 高耐受性：该电容具有良好的耐热性与耐压性能，适合于高电压和高频率的电力应用环境。
七、结论
0805B472K500NT贴片电容器以其卓越的技术参数、小型化设计以及广泛的应用场景，成为了现代电子设备中不可或缺的元件之一。无论是在消费电子产品还是在工业、通信及汽车领域，其稳定性和可靠性都能为产品的全面性能提升做出显著贡献。选择0805B472K500NT，能够有效满足您在高频、低噪声以及小型化设计方面的需求，为您的电子产品设计提供有力支持。
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