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FH 0402B122K500NT
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- FH 0402B122K500NT
- Type
- FH
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- 0402B122K500NT
- Electronic Component
- 1
- Electronic Component
- 1.2nF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.022g
- Electronic Component
- 1
- Electronic Component
- BM0257378425
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0402B122K500NT 产品概述
一、产品简介
0402B122K500NT 是风华（FH）出品的一款贴片多层陶瓷电容（MLCC），标称容值 1.2nF（122），初始容差 ±10%（K），额定直流电压 50V，温度特性 X7R，封装为 0402（1005公制）。该系列兼顾体积小、容值稳定与良好成本，是消费电子、通信与工业控制等领域常用的通用型陶瓷电容型号。
二、主要电气参数
- 容值：1.2nF（122）
- 初始容差：±10%（K）
- 额定电压：50V DC
- 温度系数：X7R（−55°C 至 +125°C，容量变化一般在 ±15% 范围内）
- 封装尺寸：0402（约 1.0mm × 0.5mm，厚度随系列不同一般 0.4–0.6mm）
- 极性：无极性（双端片式）
三、性能特点
- 体积极小，适合集成度高的表贴板设计；
- X7R 材料在宽温度范围内保持相对稳定的电容值，适用于旁路、滤波与耦合用途；
- 良好的高频特性，适合去耦和射频旁路使用；
- 风华供应链成熟，量产一致性和可追溯性良好。
四、应用场景
- 电源去耦与旁路（尤其在空间受限的 PCB 区域）；
- 滤波与耦合回路（音频、通信前端低频滤波）；
- 振荡与定时电路（与其他元件配合使用注意温漂与电压依赖性）；
- 移动终端、物联网设备、消费类电子、嵌入式控制板等。
五、使用建议与注意事项
- X7R 为 II 类介质，存在电压依赖（DC bias）与温度依赖，若电路对容值精度要求高，建议进行工作电压下的容值验证或适当降额（一般建议关键件降额至额定电压的 50% 左右）；
- 贴装时遵循 IPC/JEDEC 推荐的回流焊工艺，最高回流峰值温度通常为 260°C（以供应商工艺说明为准）；
- 避免过度弯曲基板和机械冲击，0402 体积小，易受外力损伤；储运与贴片过程注意防潮与防静电。
六、包装与采购信息
- 常见包装方式为卷带（reel）供 SMT 自动贴装使用，具体卷盘长度与每盘数量按出厂规格书提供；
- 订购型号示例：0402B122K500NT，品牌：FH（风华）；采购时请确认批次号、出厂检验报告与样片验证以保证一致性。
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