WMSIC Electronic Components

FH ABC02K1502FT

ModelABC02K1502FT
Package0402
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

14 specifications

Core information

Product name
FH ABC02K1502FT
Type
FH
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
ABC02K1502FT
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
0.01g
Electronic Component
10
Electronic Component
BM0265737689
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

风华FH ABC02K1502FT厚膜固定电阻产品概述

一、产品定位与核心参数

风华FH ABC02K1502FT属于厚膜贴片固定电阻,是针对低功耗精密电路设计的通用型元件,适配小型化电子设备的分压、限流、信号调理等场景。其核心参数如下:

项目 规格 电阻类型 厚膜固定电阻 阻值 15kΩ(代码标识:1502) 精度等级 ±1% 额定功率 62.5mW(0.0625W) 温度系数(TCR) ±100ppm/℃ 封装形式 0201(英制,0.02×0.01英寸) 工作温度范围 -55℃~+125℃

二、结构与工艺特点

该电阻采用厚膜工艺制造,结构稳定且成本可控,核心工艺环节包括:

  1. 基片支撑:以高纯度氧化铝陶瓷为基片,热膨胀系数匹配电阻层,减少温度变化导致的阻值漂移;
  2. 电阻层成型:通过丝网印刷将精密钌基电阻浆料涂覆于基片,经高温烧结(850℃左右)形成致密电阻体,阻值一致性优于±0.5%;
  3. 电极设计:两端采用银钯合金电极,焊接兼容性强(适配锡铅、无铅焊料),接触电阻≤1mΩ;
  4. 保护层封装:表面覆盖玻璃釉保护层,隔绝环境湿气、灰尘,耐腐蚀性符合GB/T 2693标准。

三、性能指标详解

  1. 阻值精度:±1%精度满足大多数工业与消费电子的基本精密需求,例如传感器信号分压、MCU外围电路限流,无需额外校准即可实现稳定输出;
  2. 功率特性:62.5mW额定功率适配低功耗场景(如便携设备、小型家电控制板),实际使用需遵循50%功率降额原则(负载功率≤31.25mW),避免过热导致阻值漂移;
  3. 温度稳定性:±100ppm/℃的温度系数表示,温度每变化1℃,阻值变化±1.5Ω(15kΩ×100ppm),可覆盖-55℃至+125℃的宽温环境,适配车载、户外小型模块;
  4. 高频特性:厚膜电阻的寄生电感、电容较低(约0.5nH、0.1pF),可支持10MHz以下的信号频率应用。

四、典型应用场景

  1. 消费电子便携设备:手机、智能手表、无线耳机的音频放大前置电路、电池管理系统(BMS)的电压采样电阻;
  2. 小型家电控制:智能插座、加湿器的MCU外围限流电路、LED指示灯分压电阻;
  3. 工业传感器模块:压力、温度传感器的信号放大电路(阻值稳定减少信号误差);
  4. 汽车电子辅助模块:车载USB充电接口、小型仪表的低功耗电路(需符合宽温要求)。

五、可靠性与质量保障

  1. 品牌资质:风华FH是国内电子元器件老牌厂商,产品通过RoHS 2.0、REACH环保认证,部分批次满足AEC-Q200汽车级可靠性要求;
  2. 环境测试:通过振动(10-2000Hz,10g加速度)、冲击(50g,11ms)、湿热(40℃/95%RH,1000h)测试,阻值变化率≤±0.5%;
  3. 批量一致性:自动化生产流程(印刷、烧结、分选)确保批量产品阻值离散度≤±0.3%,适合大规模贴装生产。

六、选型与使用注意事项

  1. 封装匹配:需适配0201封装的贴片机,PCB焊盘建议尺寸为0.6mm(长)×0.3mm(宽),避免焊盘过大导致焊接桥连;
  2. 焊接工艺:回流焊峰值温度≤260℃(时间≤10秒),手工焊接温度≤350℃(时间≤3秒),避免高温损坏电阻体;
  3. 储存条件:未开封产品储存在15-35℃、湿度≤60%环境,开封后建议1个月内使用完毕,防止电极氧化;
  4. 功率限制:严禁长时间负载功率超过额定值,否则可能导致玻璃釉保护层开裂、阻值永久性漂移。

该产品以高性价比、稳定的性能适配中小功率精密电路,是替代进口同规格电阻的主流选择之一。

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