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FH VHF100505HQ1N5ST
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FH VHF100505HQ1N5ST
- Type
- FH
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- VHF100505HQ1N5ST
- Electronic Component
- 1
- Package
- 0402
- Type
- Inductor; Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- 0.022g
- Inductor
- 1.5nH
- Electronic Component
- 1
- Factor
- 8@100MHz
- Electronic Component
- BM0234489860
- Current
- 1A
- Frequency
- 6GHz
- Resistor(DCR)
- 80mΩ
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
VHF100505HQ1N5ST 产品概述
一、产品概述
VHF100505HQ1N5ST 为风华（FH）系列贴片叠层高频电感，0402（1.0×0.5 mm）封装，标称电感值 1.5 nH。器件设计面向 VHF 及更高频段的射频/高频应用，具备较高自谐振频率与适配高速信号线的低阻抗特性，适合体积受限的移动通信、无线模块及射频前端等应用场景。
二、主要参数（典型/标称）
- 电感值：1.5 nH（标称）
- 额定电流：资料中存在两种表述，器件基础参数标称 1 A，但描述中提到 300 mA —— 实际可通过热阻和允差曲线判定，设计时应按最恶劣工况取保守值。
- 直流电阻（DCR）：典型约 80 mΩ，亦有 100 mΩ 的描述差异，请以出货数据表为准。
- 品质因数（Q）：8 @ 100 MHz（典型）
- 自谐振频率（SRF）：约 6 GHz
- 类型/封装：叠层高频电感，贴片 0402 尺寸
三、性能特点
- 高频性能优异：自谐振频率高达 GHz 级，适合 VHF 及更高频段工作，100 MHz 附近 Q 值表现良好。
- 小尺寸、低体积：0402 尺寸便于高密度 PCB 布局，适合移动终端与射频模块。
- 低直流损耗：DCR 典型较低，可降低电路功率损失与温升。
- 可用于阻抗匹配与谐振网络，亦常用于射频去耦、串联/并联谐振元件与滤波器中。
四、主要应用场景
- VHF/UHF 无线通信前端：匹配网络、负载隔离与谐振元件。
- 射频滤波与去耦：与电容器配合实现带通/带阻滤波或高频噪声抑制。
- 高速信号线的共模/差模控制（需按电流与频率特性评估）。
- 天线匹配、GPS/FM/VHF 模块等体积受限的 RF 子系统。
五、封装与焊接建议
- 推荐参考 0402 标准焊盘尺寸并留合适焊膏印刷量，避免过量焊膏导致浮装或桥连。
- 建议采用无铅回流焊工艺，遵循器件耐温极限与回流曲线，避免长时间高温导致性能漂移。
- 焊接后需避免剧烈机械应力与弯曲，贴片器件对基板应力敏感。
六、注意事项与可靠性
- 电流热降额：标称电流与实际可通过电流相关于环境温度、PCB 散热及允许温升，设计时应查阅器件热阻与电流-温升曲线并预留裕量。
- 饱和与非线性：在较高直流或射频电流下，电感可能出现饱和或有效电感下降，射频设计需验证实际工作点。
- 参数测量条件：Q、SRF 等参数受测试夹具与测量方法影响，数据表给出的典型值通常在标准测试条件下测得。
- 最终设计前请以厂方最新版数据手册为准，必要时索取样品进行实际测试以验证电磁兼容与热行为。
如需为具体电路（匹配网络、滤波器或功率路径）进行选型或仿真支持，可提供电路拓扑和工作频段，便于给出更精确的布局与参数建议。
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