Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
FH 0201CG1R5C500NT
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
17
specifications
Core information
- Product name
- FH 0201CG1R5C500NT
- Type
- FH
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- 0201CG1R5C500NT
- Electronic Component
- 1
- Electronic Component
- 1.5pF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.008g
- Electronic Component
- 10
- Electronic Component
- BM0264897113
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：0201CG1R5C500NT 贴片电容
一、产品基本信息
- 商品分类：贴片电容（MLCC, 多层陶瓷电容）
- 容值：1.5pF
- 材质（温度系数）：C0G（NP0）
- 额定电压：50V
- 品牌：风华（FH）
- 封装：0201（尺寸：0.02英寸 x 0.01英寸，约 0.5mm x 0.25mm）
二、产品特点
高精度与稳定性： 0201CG1R5C500NT 的 C0G（NP0）温度系数带来了极其优良的电压和温度特性。这种材料在广泛的温度范围内保持较高的电气稳定性，确保电容性能不会因环境变化而受到影响，适合高精度的应用场景。
小尺寸设计： 封装尺寸仅为0201，使其在设计空间受限的电路板上表现出色。小巧的体积使其能够轻松融入电子元器件密集的设计中，尤其是在智能手机、平板电脑、可穿戴设备等对空间要求极高的应用中。
额定电压： 该电容的额定电压为50V，足以满足中低压电路的需求。在高频应用或者要求高稳定性的电路中，具有更强的耐压能力，可以保证电容在长期运行中不发生击穿或失效。
良好的频率特性： 1.5pF 的小容值使其非常适合高频信号过滤、谐振电路和其他需要快速响应的应用。由于电容值较小，这款电容的自谐振频率较高，因此非常适合用于射频（RF）电路中以维护信号的完整性。
三、应用场景
射频应用： 在高频无线通信设备中，0201CG1R5C500NT能够用于频率选择电路、功率放大器的旁路电容以及调谐电路，确保信号传输的稳定性与降低信号损失。
滤波和去耦： 该电容在电源去耦和滤波电路中发挥着重要作用。其小容值和稳定性可用于去掉高频噪声，提升电流的平滑性，保护后续电路设备。
精密测量仪器： 在各种高端仪器中，0201CG1R5C500NT 能够用来构建高精度的参考信号，尤其在需要精密相位匹配和快速响应的应用场景中表现尤为突出。
消费电子： 智能手机、平板、笔记本电脑等设备中，使用小型的电容来实现高频电路增强，通常用于提高射频信号的稳定性，优化通讯性能。
四、总结
0201CG1R5C500NT 贴片电容是风华公司推出的一款高性能小型电容器，凭借其极低的容值、优秀的温度系数C0G以及50V的额定电压，广泛应用于需要高频稳定性和准确性的现代电子产品中。其0201的超小型封装使其成为当代电子设计中不可或缺的关键元件，尤其是在智能设备、射频电路和精密测量中，优化了设备性能的同时，也提升了整体系统的可靠性。对于追求高效稳定的电子设计而言，0201CG1R5C500NT 贴片电容是理想之选。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
