WMSIC Electronic Components

FH RC-02K3012FT

ModelRC-02K3012FT
Package0402
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FH RC-02K3012FT
Type
FH
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
RC-02K3012FT
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.022g
Electronic Component
30.1kΩ
Electronic Component
10
Electronic Component
BM0264498487
Operating Temperature
55℃~+155℃
Electronic Component
±100ppm/℃
Resistor Type
Resistor
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RC-02K3012FT 厚膜贴片电阻产品概述

一、产品基本定位

RC-02K3012FT是风华电子(FH) 推出的一款0402封装厚膜贴片电阻,针对小型化、高精度、宽温稳定需求设计,属于工业级常规贴片电阻范畴。产品兼顾成本与性能,适配消费电子、工业控制、汽车电子等多领域的小功率电路应用,是SMT(表面贴装技术)生产线的主流通用电阻之一。

二、核心参数详解

产品核心参数围绕精度、功率、温系、工作温区四个关键维度,具体意义如下:

1. 阻值与精度

  • 标称阻值:30.1kΩ(三位有效数字,满足1%精度的匹配需求);
  • 精度等级:±1%(即阻值偏差范围在29.799kΩ~30.401kΩ之间,可覆盖信号调理、分压电路等对阻值匹配要求较高的场景)。

2. 功率与降额特性

  • 额定功率:62.5mW(0402封装的典型额定功率,对应公制1005封装(1.0mm×0.5mm)的功率上限);
  • 降额规则:实际使用中需遵循温度降额(125℃时额定功率降为31.25mW),常规室温(25℃)下功率余量充足,可满足小电流(约[email protected]Ω)电路需求。

3. 温度系数(TCR)

  • 温系:±100ppm/℃(即温度每变化1℃,阻值变化万分之一;例如从-55℃到155℃(温差210℃),阻值最大变化2.1%,叠加初始±1%精度后,总误差≤±3.1%,可稳定适配宽温环境)。

4. 工作温区

  • 范围:-55℃~+155℃(覆盖工业级高低温要求,比民用级(-40℃~+85℃)宽,可用于户外设备、车载辅助电路等场景)。

三、封装与物理特性

RC-02K3012FT采用0402英制封装(对应公制1005),物理尺寸为1.0mm(长)×0.5mm(宽)×0.35mm(厚),适配主流SMT生产线的回流焊、波峰焊工艺,焊接兼容性符合IPC-A-610标准。

其结构为厚膜电阻:以氧化铝陶瓷为基底,通过丝网印刷厚膜电阻浆料(钌系氧化物为主)形成电阻体,表面覆盖玻璃釉保护层,两端采用银钯电极(Ag-Pd),兼具耐温、抗老化、低接触电阻等特点。

四、电气性能优势

  1. 精度稳定:±1%精度满足大部分电路的匹配需求(如传感器信号放大的偏置电阻、射频电路的匹配网络);
  2. 温区宽:-55℃~+155℃的工作范围可覆盖工业、汽车电子的极端环境;
  3. 可靠性高:厚膜工艺抗潮、抗腐蚀,风华电子的老化测试(1000小时@125℃)后阻值变化≤0.5%,符合GB/T 1772-1997《电子设备用固定电阻器 第二部分:分规范 表面安装固定电阻器》标准;
  4. 成本可控:作为常规通用电阻,批量供货稳定,价格低于高精度薄膜电阻,适合大规模量产场景。

五、典型应用场景

RC-02K3012FT的小尺寸、宽温特性使其适配多领域应用:

  1. 消费电子:蓝牙耳机、智能手环的信号滤波电路(分压电阻)、小型充电器的电压检测电阻;
  2. 工业控制:PLC(可编程逻辑控制器)的I/O接口分压电阻、传感器信号调理模块的偏置电阻;
  3. 汽车电子:车载显示屏的背光控制电路、胎压监测模块的信号放大电阻(适配-40℃~+85℃的车载环境);
  4. 通信设备:小型基站的射频前端匹配网络、光纤收发器的信号滤波电阻。

六、品牌与环保合规

风华电子(FH)是国内电子元器件龙头企业,厚膜电阻产能全球前列,产品符合RoHS 2.0(无铅、无镉、无汞)、REACH等环保标准,批量供货周期稳定(常规1-2周),售后服务完善(提供样品测试支持)。

综上,RC-02K3012FT是一款高性价比的工业级0402厚膜贴片电阻,兼顾小型化、精度与宽温稳定性,可满足多领域常规电路的电阻需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.