Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RC-02K2323FT是风华电子(FH品牌) 推出的贴片厚膜电阻,采用0402英寸(1.0×0.5mm) 小型化封装,属于工业级通用贴片电阻范畴。厚膜电阻通过丝网印刷、高温烧结工艺制备,兼具成本优势与性能稳定性,是电子电路中最常用的电阻类型之一。该型号明确对应标准化参数,为电路设计提供直接选型依据。
标称阻值为232kΩ(即232×10³Ω),精度等级**±1%**——这一精度可满足多数模拟电路、信号调理电路的阻值匹配需求,避免因偏差导致的信号失真或功率损耗异常。
62.5mW(毫瓦),与0402封装贴片电阻的典型功率范围(1/16W≈62.5mW)一致,能支撑低功耗电路的长期稳定工作,无过载风险。
±100ppm/℃——表示温度每变化1℃,阻值变化约百万分之一百(0.01%/℃)。以工作温度跨度210℃(155℃-(-55℃))计算,总阻值漂移约±2.1%,在工业级应用中属于可接受的稳定范围。
-55℃~+155℃——覆盖寒带户外设备(低温)、工业炉周边(高温)等极端环境,提升产品环境适应性。
0402封装体积仅1.0mm×0.5mm,可显著减少PCB板占用面积,适合智能手机、智能穿戴、小型通信模块等对空间要求严苛的产品。
厚膜电阻膜层与陶瓷基底结合牢固,抗机械应力、抗老化性能优于部分薄膜电阻(针对高精密场景),同时成本低于金属膜电阻,性价比突出。
±100ppm/℃的TCR与宽温范围配合,可在极端温度变化中保持阻值相对稳定,减少电路参数漂移对信号/功率的影响。
所有核心参数(阻值、精度、功率、封装)均为行业通用标准,设计人员可直接匹配电路需求,无需额外定制。
智能手机、平板电脑、智能手表的电源滤波、信号分压电路——0402封装满足小型化需求,±1%精度保障信号质量。
工业PLC模拟量输入调理、温度传感器信号放大电路——宽温范围适配工业现场高低温环境,62.5mW功率支撑低功耗模块。
车载中控屏背光控制、胎压监测信号处理电路——工作温度上限155℃,可应对车载发动机舱附近的极端高温。
小型基站射频前端滤波、路由器电源管理电路——高密度0402封装适配通信设备的PCB密集布局需求。
风华电子(FH)作为国内老牌元器件厂商,RC-02K2323FT通过ISO9001质量认证,符合RoHS、REACH环保指令。产品采用标准化生产工艺,批次间参数一致性好,可降低批量生产不良率;同时提供完善售后技术支持,快速响应选型/应用问题。
总结:RC-02K2323FT凭借小型化、高精度、宽温适应性及高性价比,成为电子电路设计中常用的贴片电阻选型,适用于多领域中低功耗、空间敏感的应用场景。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products