Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品名称:0402B473K160NT
商品分类:贴片电容(MLCC)
容值:47nF
材质(温度系数):X7R
精度:±10%
额定电压:16V
封装规格:0402
品牌:FH(风华)
0402B473K160NT 是一款高性能的多层陶瓷电容器(MLCC),广泛应用于电子设备中的滤波器、耦合电路和去耦电路等。其小型化的封装(0402)使其特别适合于现代电子产品中对空间的严格要求,如智能手机、平板电脑和其他便携式设备。
尺寸小巧:0402 封装尺寸为 1.0 mm x 0.5 mm,极大地节省了电路板的空间,使得设计师能够更加灵活地布置电路。
优异的温度特性:采用 X7R 材质,这种电容具有较好的温度特性,能够在较宽的温度范围(-55°C 到 +125°C)内保持稳定的电容值,适应各种环境条件。
高精度:±10% 的精度确保了电容在工作中的稳定性,减少了元件间的参数偏差,从而提高了整个电路的性能和可靠性。
额定电压:16V 的额定电压可以满足大多数低电压电路的需求,适合在各种消费类电子产品和工业项目中使用。
0402B473K160NT 贴片电容在以下领域具有广泛的应用:
消费类电子:智能手机、平板电脑、个人电脑等产品中,适用于去耦、滤波和耦合电路。
通信设备:网络设备、无线路由器及基站中用于信号的耦合与滤波,增强信号质量与稳定性。
工业电子:用于各种传感器和控制电路,确保在恶劣环境下也能可靠工作。
汽车电子:适合在汽车音响、导航系统及其他智能汽车配件中应用,以提高电路的稳定性和抗干扰能力。
在选择 0402B473K160NT 之前,用户应考虑以下因素:
电路工作电压:确保电路的工作电压不超过16V,以避免电容过载。
环境温度变化:如果电容器将暴露在极端的温度环境中,建议选择温度系数更为稳定的材料,比如 C0G(NP0)类型。
电路板空间:0402 封装很小,适合空间受限的设计,但如果要求更高的电容值同样可以选择组串或并联其他电容器。
0402B473K160NT 贴片电容(MLCC)以其小巧的尺寸、优异的电气特性、相对高的稳定性和良好的性价比,使其在现代电子产品设计中成为不可或缺的元件。无论是消费类电子、通信设备还是工业应用,均能找到其身影。选择这样一款电容,将为项目的成功提供有力的支持。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products