WMSIC Electronic Components

FH RS-03K1053FT

ModelRS-03K1053FT
Package0603
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FH RS-03K1053FT
Type
FH
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
RS-03K1053FT
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.03g
Electronic Component
105kΩ
Electronic Component
1
Electronic Component
BM0263548148
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RS-03K1053FT 厚膜贴片电阻产品概述

一、产品核心身份与定位

RS-03K1053FT是风华(FH)品牌推出的0603封装厚膜贴片电阻,属于通用型精密电阻范畴。该型号专为低功耗、高密度PCB布局的电子电路设计,可满足多数电子设备的阻抗匹配、分压、限流、滤波等基础功能需求,以稳定的性能、合理的成本及宽温适应性,成为消费电子、汽车电子、工业控制等领域的常用选型。

二、关键参数详解

该电阻的核心参数明确且适配主流应用场景:

  • 阻值与精度:标称阻值105kΩ(即105×10³Ω),精度±1%,可满足信号调理、传感器接口等需要准确阻值的电路需求,相比±5%的普通电阻,阻值一致性更优;
  • 功率与电压:额定功率100mW(0.1W),适配低功耗电路(如便携式设备);额定工作电压50V,满足多数低压直流电路的电压承载要求;
  • 温度特性:温度系数(TCR)±100ppm/℃,表示温度每变化1℃,阻值变化±0.01%;工作温度范围-55℃~+155℃,覆盖低温户外环境(如北方户外设备)和高温工业/汽车场景(如发动机舱);
  • 工艺类型:采用厚膜工艺制造,在氧化铝陶瓷基底上印刷电阻浆料并烧结,兼顾性能稳定性与成本控制。

三、封装与物理特性

  • 封装规格:0603英制封装(对应公制1608),尺寸为长1.6mm×宽0.8mm×厚约0.45mm,体积小巧,适合高密度PCB布局(如智能手机主板);
  • 安装方式:贴片式,兼容回流焊、波峰焊等主流SMT工艺,生产效率高;
  • 基底材料:氧化铝陶瓷,具有良好的热稳定性与绝缘性,可有效降低温度对阻值的影响。

四、性能优势解析

  1. 精度与一致性:±1%的精度及厚膜工艺的一致性控制,可保证批量应用中阻值偏差小,减少电路调试难度;
  2. 宽温适应性:-55℃~+155℃的工作范围,可满足严苛环境下的长期稳定工作,如汽车电子的高低温循环测试;
  3. 成本与性能平衡:相比薄膜电阻成本更低,相比碳膜电阻阻值更稳定,是多数中低端应用的最优选择;
  4. 可靠性保障:风华作为国内电子元器件龙头品牌,该型号符合RoHS环保标准,焊接可靠性高,长期使用不易出现阻值漂移或开路故障。

五、典型应用场景

  • 消费电子:智能手机、平板电脑的电源管理模块(限流保护)、音频电路(分压调节音量);
  • 汽车电子:车载温度传感器、压力传感器的信号调理电路(匹配阻抗)、仪表盘背光电路(限流);
  • 工业控制:PLC输入输出接口(分压信号转换)、小型电机驱动电路(限流);
  • 通信设备:路由器、交换机的信号滤波电路(与电容串联/并联)、以太网接口的阻抗匹配;
  • 智能家居:智能温控器(分压调节温度信号)、智能门锁(低功耗电路限流)。

六、选型与应用注意事项

  1. 功率降额:实际工作功率建议不超过额定功率的60%(即60mW),避免过热导致阻值漂移,高温环境下需进一步降额;
  2. 电压限制:工作电压不得超过50V,否则可能击穿电阻,高压场景需选择更高电压等级的型号;
  3. 焊接工艺:遵循风华推荐的回流焊温度曲线(如峰值温度240250℃,时间1020秒),避免焊接温度过高损坏电阻;
  4. 静电防护:贴片电阻对静电敏感,生产过程需佩戴防静电手环,存放于防静电包装中;
  5. 环境适配:在湿度较高的环境中,需确保PCB板防潮处理,避免电阻受潮影响性能。

该型号凭借稳定的性能、紧凑的封装及广泛的适应性,成为电子设计中平衡成本与性能的优选之一,可覆盖多数常规电子设备的电阻需求。

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