Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
FH 0402B562K500NT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- FH 0402B562K500NT
- Type
- FH
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- 0402B562K500NT
- Electronic Component
- 1
- Electronic Component
- 5.6nF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.022g
- Electronic Component
- 1
- Electronic Component
- BM0257366821
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0402B562K500NT 产品概述
一、产品简介
0402B562K500NT 为风华（FH）系列贴片多层陶瓷电容（MLCC），公称容量 5.6nF（562），精度 ±10%（K），额定电压 50V，介质材料为 X7R。该型号面向对体积和性能有较高要求的便携与高密度电路应用，兼顾容值稳定性与温度特性。
二、主要性能与规格
- 容值：5.6nF ±10%
- 额定电压：50V DC
- 温度特性：X7R（工作温度范围约 -55℃ 至 +125℃，在此范围内容值变化通常在 ±15% 左右）
- 封装：0402（约 1.0 × 0.5 mm）
- 介质特性：良好介电常数与体积比，适合去耦/滤波/耦合等用途
三、结构与封装
0402 小尺寸封装适合高密度 SMT 布局，适配主流无铅回流工艺。陶瓷多层结构提供较低等效串联电阻（ESR）和较小体积，但相比 NP0/C0G 在温度稳定性和线性方面具有一定限制。
四、应用场景
适用于手机、可穿戴设备、蓝牙/IoT 模块、数模混合电路的旁路/去耦、信号耦合、滤波网络及尺寸受限的高密度板级电路。也常作为电源去耦与 EMI 滤波器件使用。
五、使用与选型注意事项
- DC 偏压与电场效应：X7R 在高偏压下会产生显著容值下降，0402 小尺寸在 50V 下的实际有效容值需通过数据表或实测确认；关键场合建议留有裕量或并联更大电容。
- 温度与频率依赖：X7R 在温度和频率上有非线性变化，时序/滤波电路应评估工作点的实际表现。
- 布局建议：靠近 IC 电源引脚放置，缩短走线并使用足够焊盘面积与过孔以降低寄生感抗。
六、可靠性与焊接建议
推荐遵循厂商提供的 Pb-free 回流焊曲线；避免过热和剧烈温度循环导致裂纹。储存应防潮密封包装，必要时按规定烘烤后回流。小尺寸器件在波峰/手动焊接时需注意夹持与取放工艺。
七、包装与订购信息
常见为卷装（Reel）出货，适配自动贴片机。订购时请核对完整料号与批次，并向供应商索取详尽数据表、封装尺寸图与焊接规范以便于设计验证与可靠性评估。
总结：0402B562K500NT 以其小体积、高密度适配能力和 X7R 的成本/性能平衡，适合多数消费电子与工业类去耦与滤波场合；在关键电压/温度工况下，应对 DC 偏压与温漂进行验证和余量设计。若需元件数据表或测试曲线，可联系供应商获取详尽资料。
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