Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
FH 0402CG3R6C500NT
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
17
specifications
Core information
- Product name
- FH 0402CG3R6C500NT
- Type
- FH
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- 0402CG3R6C500NT
- Electronic Component
- 1
- Electronic Component
- 3.6pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.022g
- Electronic Component
- 1
- Electronic Component
- BM0263547987
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：0402CG3R6C500NT 贴片电容 (MLCC)
概述
0402CG3R6C500NT 是一款高性能的多层陶瓷电容器（MLCC），其主要特点包括容值为3.6pF的贴片电容，额定电压为50V，采用C0G温度系数材料，封装形式为0402。该元件由知名品牌风华电子（FH）生产，适用于多种电子和电气应用，尤其在高频信号处理及滤波电路中表现出色。
产品细节
商品分类：贴片电容（MLCC） 贴片电容广泛应用于电子电路中，通过表面贴装（SMD）技术方便地集成到电路板上。0402的尺寸增大了设计的灵活性，使其能在空间受限的电子设备中发挥重要作用。
容值：3.6pF 该电容的容值为3.6皮法（pF），使其非常适合高频应用。较小的电容值通常应用于信号耦合、增益调整、和阻抗匹配等领域，能够显著降低电路对高频信号的衰减，从而提升信号传输的质量。
温度系数：C0G C0G材料（又称为NP0）具有非常稳定的电气性能，尤其是在温度变化和电压变化下的表现。相较于其他类型的电容器，C0G电容器的温度系数极小，线性好，具有低失真的特性，特别适合高精度和高稳定性要求的应用场景。
额定电压：50V 该电容的额定电压为50V，意味着其可承受的最大电压为50V。在设计电路时，应确保电容工作电压不会超过其额定值，以维持电路的安全及可靠性。这一额定电压使得0402CG3R6C500NT可以应用于中等电压环境的电子产品。
封装形式：0402 封装0402（尺寸约为1.0mm x 0.5mm）是目前电子组件中最小的表面贴装尺寸之一。这种贴片设计不仅节约了PCB板空间，还能降低元器件的自感和寄生电容，提高了信号的传输效率，特别适合高密度的电子设备如移动设备、消费电子和高频通信设备等。
品牌：FH（风华） 风华电子（FH）是全球知名的电子元器件制造商，以其高品质和高可靠性的产品闻名。该品牌致力于持续创新与品质管理，使其产品能够满足不同行业和市场的需求。
应用场景
0402CG3R6C500NT 贴片电容适用于广泛的应用场景，尤其在以下领域中发挥着重要作用：
- 无源滤波器：在高频电路中作为无源滤波器，帮助消除不必要的高频噪声，确保信号的纯净性。
- 信号耦合和解耦：在放大器和其他电路中充当信号耦合或解耦电容，改善电路的性能和稳定性。
- 高频电路：在射频(RF)设备、通信设备和高频数码电路中，提供良好的阻抗匹配和信号传输。
- 消费电子产品：在智能手机、平板电脑、电视和其他消费电子中，用于改进其性能和功能性。
结论
0402CG3R6C500NT是一款兼具高性能与高质量的贴片电容，凭借其小巧尺寸、高额定电压以及稳定的工作特性，成为现代电子产品中不可或缺的关键元件。随着电子技术的发展和高密度设计需求的增强，该款电容的应用前景将更加广泛，为各种高频和精密电路提供可靠的解决方案。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
