Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
一、概述 0402CG1R8B500NT是一款高性能的多层陶瓷电容器(MLCC),其主要特点包括特定的容量、结构材料、额定电压以及封装尺寸。作为一款贴片电容,它的容值为1.8 pF,额定电压为50V,并采用C0G(NP0)温度系数材料。这些特性使得该电容器广泛应用于各种电子元器件组中。
二、技术参数
三、产品特性
高稳定性:C0G材料具有极低的电容变化率,能够在不同温度和电压条件下维持较高的稳定性。这一特性使得0402CG1R8B500NT能够在高频电路中表现出色,尤其适合用于信号处理、谐振电路、滤波器等对电容精度要求高的应用场景。
小型化设计:0402的封装尺寸使得该电容器在现代紧凑型电子设备中表现优异。小型设备如智能手机、平板电脑、可穿戴设备及其他消费电子产品都可以有效利用这种小型电容。
高绝缘电压:该电容器的额定电压为50V,适合中等电压下的应用。50V的绝缘值意味着该电容器能承受较高电压而不发生击穿,确保了电路的安全性和稳定性。
良好的频率特性:0402CG1R8B500NT适用于高频应用,可在高达几百MHz的频率下正常工作,非常适合用于RF(射频)及微波应用。
四、应用领域 0402CG1R8B500NT广泛应用于以下领域:
五、使用建议 在实际应用中,应注意0402CG1R8B500NT的工作环境,保证其在额定电压以下使用。此外,尽量避免在高温或高湿度环境下使用,以保证其长久的稳定性和可靠性。在焊接时,建议采用适当的温度和时间,以防止影响电容器的性能。
六、总结 0402CG1R8B500NT是一款极具竞争力的贴片电容,凭借其高稳定性、小型化设计以及优良的电气特性,成为现代电子设备中不可或缺的元器件之一。通过合理的应用和维护,可以充分发挥其性能,为电子产品的功能和质量提供坚实的支持。考虑到当前电子行业日益发展的趋势,0402CG1R8B500NT将继续在多个领域中扮演着重要的角色。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products