Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0402CG0R5C500NT是风华高科(FH)推出的超稳定型MLCC,核心属性与型号命名逻辑如下:
该型号采用成熟叠层工艺,专为高频、高精度、温度稳定的电路场景设计,属于Class 1陶瓷介质范畴。
0402封装是小型化贴片电容的主流规格,公制典型尺寸(含电极):
封装优势:体积紧凑(仅为0603封装的1/4),适配高密度PCB设计(最小焊盘间距0.2mm),适合便携设备及小型化模块。
基于C0G介质的超稳定特性,关键电气参数(25℃、1kHz测试条件):
参数 典型值/额定值 备注 额定电压(Vdc) 50V 直流工作电压上限 标称容值(C) 0.5pF 精密小容值设计 容值精度 ±0.05pF(±10%) 小容值C0G的高精度要求 损耗角正切(DF) ≤0.0005(0.05%) 高频损耗极低 绝缘电阻(IR) ≥10^12Ω 25℃、50V直流测试 工作温度范围 -55℃ ~ +125℃ 工业级温度适应性注:容值随温度变化率≤±0.015pF(对应温度系数0±30ppm/℃),是Class 1介质中最稳定的类型。
C0G(NP0)是MLCC中温度稳定性最优的介质,区别于X7R/Y5V等Class 2介质,核心优势:
该电容因小体积、高稳定、低损耗,广泛用于以下领域:
风华0402CG0R5C500NT通过多项可靠性测试及环境认证:
该型号凭借C0G介质的超稳定特性,成为高频精密电路的首选元件,兼顾小型化与可靠性,适配多领域应用需求。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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