WMSIC Electronic Components

FH RC-02K1053FT

ModelRC-02K1053FT
Package0402
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FH RC-02K1053FT
Type
FH
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
RC-02K1053FT
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.022g
Electronic Component
105kΩ
Electronic Component
10
Electronic Component
BM0230596368
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RC-02K1053FT 产品概述

一 外观与封装

RC-02K1053FT 为贴片厚膜电阻,封装尺寸为 0402(公制 1005 或美制 0402),由品牌 FH(风华)生产。外观为矩形小型片式元件,适用于高密度表面贴装(SMT)线路板,支持自动贴装与回流焊工艺。

二 主要电气参数

  • 阻值:105 kΩ
  • 精度:±1%
  • 功率:62.5 mW(额定功率)
  • 工作电压:50 V
  • 温度系数(TCR):±100 ppm/℃
  • 电阻类型:厚膜电阻

三 特性与优势

  • 精度高:±1% 的公差满足多数精密信号与分压场合需求。
  • 稳定性好:±100 ppm/℃ 的温度系数在温度变化时保持阻值稳定,适合温变敏感电路。
  • 小尺寸:0402 封装能显著减小电路板占用空间,利于紧凑型与多层板设计。
  • 宽温范围:可在 -55℃ ~ +155℃ 环境下可靠工作,适用于工业级与苛刻环境应用。

四 可靠性与工作环境

该器件设计满足商用/工业级环境要求,工作温度范围 -55℃ ~ +155℃,可承受常见温度循环和热应力。需注意 0402 封装的功率和散热能力有限,长期工作时建议考虑功率余量与热管理。

五 典型应用场景

  • 精密分压与信号偏置电路
  • 模拟前端、小信号滤波与反馈回路
  • 移动设备、可穿戴与消费电子中高阻值需求场合
  • 工业控制与传感器接口,要求宽温工作范围的应用

六 安装与使用建议

  • 按照厂家推荐的回流焊曲线进行焊接,避免超温和过长的保温时间以防阻值漂移。
  • 由于功率仅 62.5 mW,设计时应做功率和温升余量(必要时做降额设计)。
  • 工作电压上限为 50 V,应用中不得超过此值以防绝缘击穿或非线性行为。
  • 储存与搬运时避免机械应力、弯曲和过度振动,清洗时选用对厚膜无侵蚀的溶剂。

七 选型与采购注意事项

  • 确认所需阻值为 105 kΩ 且公差 ±1% 后再下单,避免与其他“105”标识(如 1 MΩ)混淆。
  • 对批次一致性、温漂要求较高的设计,建议索取样品做温度与长期稳态测试。
  • 采购时可向供应商确认包装方式(卷带/盘装)与回流焊兼容性,以便生产线适配。

总体而言,RC-02K1053FT 是一款适合高密度 PCB 和对温漂、精度有一定要求的厚膜贴片电阻器件。在遵守额定功率与工作电压限制的前提下,能为小型化与工业级应用提供可靠的阻值元件选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.