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Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
FH 0402B822K500NT
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- FH 0402B822K500NT
- Type
- FH
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- 0402B822K500NT
- Electronic Component
- 1
- Electronic Component
- 8.2nF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.022g
- Electronic Component
- 1
- Electronic Component
- BM0257367092
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0402B822K500NT 产品概述
一、基本信息
0402B822K500NT 为风华（FH）系列贴片多层陶瓷电容（MLCC），主要参数如下：容值 8.2nF（822）、公差 ±10%（K）、额定电压 50V、介质 X7R、封装 0402（约 1.0 × 0.5 mm）。适用于对体积要求高、需要中等容量的高密度贴片布局场合。
二、主要特性
- 小尺寸高密度：0402 封装适合空间受限的移动设备和高密度 PCB。
- 温度特性：X7R 介质工作温度范围 -55℃ 至 +125℃，在此范围内电容量变化通常在 ±15% 以内。
- 电气性能：低等效串联电阻（ESR）和低寄生电感，适合去耦、滤波与射频前端匹配。
- 直流偏压效应：X7R 属高介电常数材料，在施加直流电压时电容量会有明显下降，尤其是小封装高电压规格，需要关注厂商的 C–V 曲线。
- 环保与可靠性：一般符合无铅与 RoHS 要求，具体可靠性等级（如是否 AEC‑Q200）请向供应商确认。
三、典型应用场景
- 电源去耦与旁路（DC‑DC、LDO 输出侧）
- 高频滤波与阻抗匹配
- 信号耦合/旁路与噪声抑制
- 常用于便携电子、通信设备、消费类电子及工业控制等场合
四、选型与使用建议
- 考虑直流偏压：若工作电压接近 50V，需参考厂家 C‑V 曲线并适当预留余量，关键电路建议进行额定电压 30%~50% 的降额设计或在样机上验证实际容量。
- 温度与老化：X7R 有时间老化效应及温度依赖，精密应用可优先考虑 NP0/C0G。
- 焊接与加工：建议无铅回流工艺峰值温度 245℃（JEDEC 推荐，最高不超过 260℃），预热与保温时间按厂商资料执行。避免在 PCB 装配过程中产生弯曲或夹紧应力。
- 储存与包装：通常为卷带（Tape & Reel）包装，注意干燥密封存储并遵循 MSL 要求以防潮湿导致焊接缺陷。
五、获取资料与品质保证
在最终设计与大批量采购前，请索取风华官方数据手册，确认 C–V 曲线、机械尺寸图、回流曲线、寿命与可靠性试验报告以及包装规格。对关键或汽车级应用，要求供应商提供相应的资格与认证文件。
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