WMSIC Electronic Components

FH RC-01W8252FT

ModelRC-01W8252FT
Package0201
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FH RC-01W8252FT
Type
FH
Minimum package
15000 圆盘

Technical parameters

Power
50mW
Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
RC-01W8252FT
Electronic Component
1
Package
0201
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.008g
Electronic Component
82.5kΩ
Electronic Component
50
Electronic Component
BM0265116696
Operating Temperature
55℃~+125℃
Operating Voltage
25V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RC-01W8252FT 厚膜贴片电阻产品概述

RC-01W8252FT是风华电子(FH) 推出的一款通用型小功率厚膜贴片电阻,采用超小0201封装,针对高密度PCB设计和精准阻值需求场景优化,平衡了性能、体积与成本,是消费电子、工业控制等领域的常用器件。

一、产品核心身份与定位

该产品属于风华厚膜贴片电阻系列,聚焦50mW级小功率、±1%高精度、超小0201封装的应用场景,既满足便携式设备的空间限制,又能为需要精准分压/限流的电路提供稳定阻值,是替代传统碳膜电阻的高性价比方案。

二、关键参数详解

各核心参数直接决定了产品的适用范围,具体解读如下:

  1. 阻值与精度:标称阻值82.5kΩ,采用“8252”代码标识(前3位为有效数字825,第4位为10²倍率);精度±1%,远优于普通碳膜电阻的±5%,可满足大多数对阻值误差敏感的电路(如传感器信号调理、基准电压分压)。
  2. 功率与电压:额定功率50mW(0.05W),是0201封装电阻的典型功率等级;最大连续工作电压25V,需注意电路中实际电压需低于此值,且功率需结合环境温度降额使用(如125℃时功率需降至约25mW)。
  3. 温度系数(TC):±200ppm/℃,表示温度每变化1℃,阻值变化±200×10⁻⁶。例如,当环境温度从25℃升至125℃(温差100℃),阻值变化约±2%,结合±1%精度,总阻值误差控制在±3%以内,满足宽温环境下的稳定需求。
  4. 工作温度范围:-55℃~+125℃,覆盖工业级宽温要求,可适应户外设备(如太阳能控制器)、车载电子等极端环境。

三、封装与工艺特性

  1. 0201超小封装:英制尺寸0.02×0.01英寸(约0.508×0.254mm),是贴片电阻中最小的封装之一,适合智能手机、智能穿戴、微型传感器等对PCB面积要求严苛的产品,可显著提升电路集成度。
  2. 厚膜工艺优势:采用厚膜印刷技术制造,相比薄膜电阻成本更低,且耐湿性、抗冲击性更强;相比碳膜电阻,阻值稳定性更好、温度系数更低,在批量生产中一致性优异。
  3. 表面贴装设计:支持自动化贴装(SMT),生产效率高,适合大规模工业化生产,同时减少手工焊接误差,提升电路可靠性。

四、典型应用场景

基于参数与特性,该产品适用于以下场景:

  1. 便携式电子设备:智能手机、智能手环、蓝牙耳机等,利用0201小封装节省空间,50mW功率满足低功耗电路需求。
  2. 工业控制电路:PLC模块、传感器信号调理电路,宽温范围(-55~125℃)适配户外控制柜、高温车间环境。
  3. 消费电子终端:机顶盒、路由器、智能电视的辅助电路(如LED指示灯限流、电压分压),±1%精度保证信号稳定。
  4. 小型通信设备:4G/5G微型基站、WiFi模块的射频辅助电路,小功率需求与高集成度要求匹配。
  5. 车载电子组件:车载显示屏、传感器接口电路,宽温特性适应汽车发动机舱等高温环境。

五、可靠性与质量保障

  1. 风华品牌背书:作为国内电子元器件龙头企业,风华电子的厚膜电阻工艺成熟,产品通过RoHS、REACH等环保认证,符合国际标准。
  2. 可靠性测试:产品经过高低温循环、湿热老化、振动冲击等可靠性测试,可保证在1000小时以上的长期使用中阻值变化率≤0.5%。
  3. 降额使用建议:为延长寿命,建议在环境温度超过70℃时,功率按降额曲线降低(如70℃时功率为额定的80%,100℃时为50%),避免过功率/过电压损坏。

总结

RC-01W8252FT是一款高性价比的通用型厚膜贴片电阻,以超小0201封装、±1%精度、宽温范围为核心优势,覆盖消费电子、工业控制、车载等多领域应用。其平衡了性能与成本,适合对空间、精度、可靠性有综合要求的电路设计,是工程师选型时的优质选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.