WMSIC Electronic Components

FH 0201CG2R7B500NT

Model0201CG2R7B500NT
Package0201
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

17 specifications

Core information

Product name
FH 0201CG2R7B500NT
Type
FH
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
0201CG2R7B500NT
Electronic Component
1
Electronic Component
2.7pF
Package
0201
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
0.008g
Electronic Component
10
Electronic Component
BM0265117029
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
15000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FH风华0201CG2R7B500NT贴片电容产品概述

一、产品核心身份与应用定位

FH风华0201CG2R7B500NT是一款针对高频稳定场景设计的0201封装贴片陶瓷电容,核心定位为射频通信、高精度电子设备中的“稳定型容值元件”。作为风华电子的主流NP0类(C0G)电容之一,其通过优化陶瓷配方与封装工艺,实现了容值对温度、电压、频率的极低敏感度,适配对信号精度要求苛刻的小型化电子系统。

二、基础参数详解(电气+物理)

该电容的核心参数围绕“高精度+小体积”设计,关键指标如下:

  • 电气参数:容值2.7pF,容差±0.1pF(C0G材质的典型高稳定公差);额定电压50V(满足多数低/中压高频场景需求);温度系数C0G(即NP0,温度范围-55℃~125℃内,容值变化≤±0.3%);高频损耗角正切tanδ≤0.001(1kHz下)。
  • 物理参数:封装尺寸0201(英制,对应公制0402,尺寸0.6mm×0.3mm);厚度0.3mm(比常规0201封装更薄,适配超薄设备);端电极采用镍锡(Ni/Sn)镀层,兼容回流焊工艺。

三、C0G材质的性能优势

该电容采用C0G(NP0)陶瓷材质,是区别于X7R、Y5V等材质的核心优势:

  1. 温度稳定性:-55℃~125℃范围内,容值变化≤±30ppm/℃,远优于X7R的±15%变化,可在极端温度环境下保持信号精度;
  2. 电压稳定性:容值随工作电压变化极小(≤0.1%),避免因电压波动导致的电路参数漂移;
  3. 高频特性:高频损耗低(1GHz下仍保持低阻抗),适合射频信号传输,不会引入额外信号衰减;
  4. 长期可靠性:老化率≤0.1%/1000小时,长期使用后容值无明显漂移,符合工业级与消费级电子的寿命要求。

四、典型应用场景

结合参数特性,该电容广泛应用于以下场景:

  • 射频通信模块:蓝牙5.0/6.0、WiFi 6E、GPS等模块的LC滤波器、振荡器、匹配网络,保证信号带宽与相位一致性;
  • 小型化消费电子:智能手表、无线耳机的天线匹配电路,利用小体积适配设备轻薄化需求;
  • 医疗电子:便携式监护仪的信号调理电路,依赖其稳定容值实现精准信号采集;
  • 汽车电子:车载蓝牙、胎压监测系统的高频电路,耐受车载环境的温度波动(-40℃~85℃)。

五、封装与可靠性说明

0201封装的优势与风华的可靠性保障:

  • 封装兼容性:0.6mm×0.3mm的小体积,适配高密度PCB设计,支持贴装密度达1000+元件/平方厘米;
  • 焊接可靠性:Ni/Sn端电极可承受260℃回流焊温度(符合IPC标准),焊点强度满足跌落测试要求(1.5m跌落无开路);
  • 环境适应性:通过湿热试验(85℃/85%RH,1000小时)、温度循环试验(-55℃~125℃,1000次循环),无性能衰减。

六、选型价值与使用建议

  1. 选型价值:风华作为国内知名电容品牌,该产品性价比优于进口同参数电容,且交期稳定(常规1-2周);
  2. 使用注意:
    • 焊接时避免局部过热(≤260℃/3秒),防止陶瓷开裂;
    • 贴装后避免机械应力(如弯曲PCB),0201封装抗应力能力较弱;
    • 替代选型:若需更高电压(如100V),可选择风华0201CG2R7B101NT;若需更大容值(如10pF),则切换至X7R材质。

该产品凭借“小体积+高稳定”的核心特性,成为射频、通信等领域小型化设备的优先选型之一,兼顾性能与成本优势。

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