WMSIC Electronic Components

FH RS-05K1103FT

ModelRS-05K1103FT
Package0805
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FH RS-05K1103FT
Type
FH
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
RS-05K1103FT
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.027g
Electronic Component
110kΩ
Electronic Component
1
Electronic Component
BM0264865327
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RS-05K1103FT 产品概述

一、产品简介

RS-05K1103FT 为风华(FH)推出的一款贴片厚膜固定电阻,封装为0805(2012公制),阻值110kΩ,精度±1%,额定功率125mW,适用于中高阻值的通用电路与精密模拟场合。工作电压标称150V,温度系数(TCR)为±100ppm/℃,工作温度范围为-55℃~+155℃,适配多种工业与消费电子应用。

二、主要特性

  • 厚膜工艺,良好的成本与批量一致性;
  • 阻值110kΩ,精度±1%满足较高稳定性需求;
  • 额定功率125mW,工作电压150V,适合高阻值偏置与限流场合;
  • TCR ±100ppm/℃,在温度变化下具有可预测的阻值漂移;
  • 封装0805,适合自动贴装与常规无铅回流焊工艺。

三、电气与环境参数

  • 阻值:110kΩ ±1%
  • 额定功率:125mW(环境与PCB散热条件会影响实际功耗,需考虑热降额)
  • 最高工作电压:150V
  • 温度系数(TCR):±100ppm/℃
  • 工作温度:-55℃~+155℃

四、典型应用场景

  • 电压分压、偏置网络与基准回路中的高阻值元件;
  • 模拟前端、滤波、阻抗匹配及输入保护电路;
  • 测量仪器与传感器接口的拉高/拉低电阻;
  • 消费电子、工业控制、通讯设备中需要空间节约的通用场合。

五、封装与焊接建议

0805(2012)封装适配常见PCB占位,推荐使用自动贴装与回流焊流程。为保证可靠性,建议采用符合无铅回流(Pb‑free)工艺的温度曲线,峰值温度建议参照JEDEC/IPC标准进行控制。高阻值和较低功耗特性使其对热冲击敏感度较低,但仍应避免超过推荐回流工艺参数。

六、可靠性与选型注意事项

  • 在高温或高湿环境中,请关注热降额与长时间漂移;
  • 对于要求更高温度系数或长期稳定性的应用,建议评估金属膜或薄膜电阻作为替代;
  • 在高压或瞬态条件下,需验证电阻的耐压与绝缘特性;
  • 选择时考虑PCB散热、邻近元件热源及焊盘设计以确保额定功率能被安全利用。

七、包装与存储

常见为卷盘式(Tape & Reel)包装,便于自动贴装。存储建议干燥、避免直接阳光并控制环境湿度与温度,若长期存放建议遵循出厂防潮规范。

RS-05K1103FT 以其通用的0805封装、较高阻值与较好的一致性,适合空间受限但需稳定偏置与精度控制的电路应用。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.