WMSIC Electronic Components

FH 0201CG2R2C500NT

Model0201CG2R2C500NT
Package0201
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

17 specifications

Core information

Product name
FH 0201CG2R2C500NT
Type
FH
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
0201CG2R2C500NT
Electronic Component
1
Electronic Component
2.2pF
Package
0201
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
0.008g
Electronic Component
10
Electronic Component
BM0264879618
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
15000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0201CG2R2C500NT 贴片多层陶瓷电容(MLCC)产品概述

一、产品身份与核心定位

0201CG2R2C500NT是风华电子(FH) 推出的高频高精度贴片多层陶瓷电容(MLCC),型号编码直接映射核心参数:

  • 「0201」:英制封装规格(对应公制0603);
  • 「CG」:介质材料代码(C0G/NP0型);
  • 「2R2」:容值标识(2.2皮法,pF);
  • 「500」:额定直流电压(50V);
  • 「NT」:风华内部后缀(代表标准编带包装+常规精度)。

该产品定位于对温度稳定性、低损耗要求苛刻的小型化电路,是射频、精密模拟、工业控制等领域的基础核心元件。

二、关键性能参数详解

核心参数决定应用场景,0201CG2R2C500NT的关键指标如下:

  1. 容值与精度:标称2.2pF,常规精度±0.25pF(或±0.5%),满足多数精密电路的匹配需求;
  2. 额定电压:直流50V(DC),交流应用需按1/2额定电压降额(25V AC),适配低电压电路长期稳定;
  3. 温度系数:C0G型(NP0),温度系数≤±30ppm/℃(-55℃~125℃范围),容值随温度变化≤±0.25pF;
  4. 损耗角正切(DF):≤0.15%(1kHz测试),低损耗减少高频信号能量衰减;
  5. 额定电流:≤100mA(DC),适配小功率信号电路的电流承载。

三、封装与物理特性

采用0201英制贴片封装(公制0603),是小型化电子设备的主流封装,物理尺寸符合行业标准:

  • 长度:0.60±0.03mm;
  • 宽度:0.30±0.03mm;
  • 厚度:0.30±0.03mm;
  • 端电极:银钯合金内层+镍/锡无铅外层,兼容回流焊、波峰焊,焊接可靠性高;
  • 包装:10k/盘编带,适配自动贴片机批量生产。

四、材料与温度稳定性优势

C0G(NP0)是核心介质材料,区别于X7R等高容值材料,优势显著:

  • 超宽温稳定:-55℃(工业下限)至125℃(汽车级接近值)范围内,容值变化可忽略,适配极端环境;
  • 低损耗:介质损耗远低于X7R、Y5V,高频信号传输时信号完整性好;
  • 无极性:无需区分正负极,贴装无需额外识别,提升生产效率。

五、典型应用场景

因温度稳定、低损耗、小型化,广泛应用于:

  1. 高频振荡电路:石英晶体振荡器(XO)的负载电容,稳定振荡频率(避免温度漂移);
  2. 射频前端模块:手机、路由器的滤波器、阻抗匹配网络(低损耗减少信号衰减);
  3. 精密模拟电路:运放的反馈/补偿电容(温度稳定保证输出精度);
  4. 工业控制设备:PLC、传感器的信号滤波(宽温适配工业环境);
  5. 智能穿戴:智能手表/手环的射频电路(0201封装满足小型化)。

六、可靠性与合规性

风华作为国内MLCC龙头,产品可靠性符合行业及国际标准:

  • 可靠性测试:通过高温高湿(85℃/85%RH,1000h)、温度循环(-55~125℃,1000次)、回流焊热冲击(260℃)等测试,失效率低;
  • 环保合规:无铅端电极,符合RoHS 2.0、REACH指令,满足欧盟及国内环保要求;
  • 一致性:叠层印刷+共烧工艺,批量容值偏差≤±0.25pF,一致性好。

七、选型替代参考

若需替代或扩展,可参考同类产品:

  • 同参数替代:村田GRM0335C1H2R2CA01D、TDK C1608C0G2R2J500T;
  • 风华同系列扩展:0201CG1R0C500NT(1pF)、0201CG3R3C500NT(3.3pF)、0201CG1R0C100NT(100V)。

该产品以高稳定性、小型化、低损耗的特点,成为精密电子电路的优选元件之一。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.