WMSIC Electronic Components

FOJAN FRC0402F1200TS

ModelFRC0402F1200TS
Package0402
BrandFOJAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOJAN FRC0402F1200TS
Type
0402
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
FOJAN
Electronic Component
FRC0402F1200TS
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.01g
Electronic Component
120Ω
Electronic Component
10
Electronic Component
BM0264520366
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FRC0402F1200TS 贴片厚膜电阻产品概述

一、产品基本定位与核心参数

FRC0402F1200TS是FOJAN(富捷)推出的一款0402封装贴片厚膜电阻,专为小体积、低功耗电子设备设计,核心参数精准覆盖常规电路的匹配需求:

  • 阻值:120Ω(代码标识“1200”,符合电阻值代码规则);
  • 精度:±1%(满足工业级、消费电子的常规阻抗匹配要求);
  • 额定功率:62.5mW(适配低功耗信号处理场景);
  • 最大工作电压:50V(避免高压击穿风险);
  • 温度系数:±100ppm/℃(阻值随温度变化可控);
  • 工作温度范围:-55℃~+155℃(宽温环境适应性强)。

该产品参数经出厂严格校准,一致性符合行业标准,可直接替代同类进口/国产0402封装电阻。

二、封装与工艺特性

2.1 封装规格

采用0402英制封装(对应公制尺寸1.0mm×0.5mm),体积紧凑,适合高密度贴装设计——可在单位面积内实现更多电路布局,满足智能穿戴、小型通信设备等对空间严格要求的场景。封装引脚采用镀锡工艺,焊接兼容性好,适配无铅回流焊、波峰焊等主流贴装工艺。

2.2 厚膜工艺优势

基于厚膜丝网印刷工艺制造,具备三大核心优势:

  • 成本可控:相比薄膜电阻,厚膜工艺在中低功率、常规精度下更具性价比;
  • 稳定性佳:厚膜层与陶瓷基底结合牢固,长期使用阻值漂移小;
  • 批量一致性好:丝网印刷工艺可实现大规模生产,参数离散性低。

三、性能优势解析

3.1 精度与温度稳定性

±1%的阻值精度可满足多数电路的阻抗匹配需求(如分压电路、信号衰减电路);±100ppm/℃的温度系数在宽温范围内表现稳定——以155℃为例,相对于25℃基准温度,阻值变化仅为120Ω×100ppm×130℃=1.56Ω,仍在±1%精度区间内,无需额外温度补偿。

3.2 功率与电压耐受

62.5mW额定功率适配低功耗电路(如传感器信号调理、LED驱动辅助电路);50V最大工作电压可避免小信号电路中因电压波动导致的击穿问题,提升电路可靠性。

3.3 环境适应性

-55℃~+155℃的工作温度范围覆盖了工业控制、汽车电子次级电路的典型环境(如汽车发动机舱附近、户外工业传感器节点),无需额外降温/保温措施即可稳定工作。

四、典型应用场景

4.1 小型消费电子

  • 智能手环/蓝牙耳机:信号放大电路偏置电阻、电池管理模块分压电阻;
  • 便携式音箱:音频信号衰减电阻、电源滤波辅助电阻。

4.2 工业控制模块

  • 小型PLC:数字输入/输出接口限流电阻;
  • 低功耗传感器:温度/湿度传感器信号调理电阻。

4.3 汽车电子次级电路

  • 车内LED指示灯:驱动电路限流电阻;
  • 小功率传感器:胎压监测、车门传感器信号处理电阻(宽温适配汽车环境)。

4.4 通信设备

  • 小型基站:射频前端匹配电阻;
  • 路由器:电源模块分压电阻。

五、可靠性能验证

FOJAN对该产品进行了多项可靠性测试,确保长期使用稳定性:

  • 温度循环测试:-55℃~+155℃循环1000次,阻值变化≤0.5%;
  • 耐湿测试:85℃/85%RH环境下放置1000小时,阻值变化≤1%;
  • 焊接可靠性:无铅回流焊后,引脚无脱落/虚焊,阻值无明显漂移。

产品符合IEC 61000-4-2(静电放电)、IEC 61000-4-3(射频电磁场辐射)等电磁兼容标准,可适配复杂电磁环境。

六、选型与使用注意事项

6.1 功率降额建议

实际使用功率建议不超过额定功率的70%(即≤43.75mW),避免过热导致阻值漂移;高温环境(>125℃)下,降额比例需提升至50%(≤31.25mW)。

6.2 电压限制

严格遵循最大工作电压50V的限制,若电路电压波动可能超50V,需串联TVS管等保护元件。

6.3 贴装要求

0402封装体积小,贴装时需注意:

  • 贴装精度≤±0.05mm,避免桥接/偏移;
  • 回流焊峰值温度230℃~245℃,时间≤30秒。

6.4 存储条件

未开封产品存储在-20℃~+30℃、湿度≤60%的环境中,开封后建议12个月内使用完毕,避免引脚氧化影响焊接质量。

FRC0402F1200TS凭借紧凑封装、稳定性能及宽温适应性,成为小体积电子设备的优选电阻元件,可满足多领域的常规应用需求。

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