WMSIC Electronic Components

FOJAN FRC0402F37R4TS

ModelFRC0402F37R4TS
Package0402
BrandFOJAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOJAN FRC0402F37R4TS
Type
0402
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
FOJAN
Electronic Component
FRC0402F37R4TS
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.01g
Electronic Component
37.4Ω
Electronic Component
10
Electronic Component
BM0265305932
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FRC0402F37R4TS 贴片厚膜电阻产品概述

一、产品基本定位

FRC0402F37R4TS是FOJAN(富捷)电子推出的一款0402封装高精度小功率厚膜贴片电阻,专为小型化、低功耗电子设备的精密信号处理与电源管理场景设计。该产品平衡了精度、体积与成本,可满足消费电子、工业控制、汽车辅助电子等领域对稳定电阻元件的需求,是高密度PCB布局的理想选择。

二、核心性能参数解析

该电阻的关键参数明确了应用边界与精度优势:

  1. 阻值与精度:额定阻值37.4Ω,精度±1%,属于工业级高精度范畴,可精准匹配电路的分压、限流、阻抗匹配等需求,避免因阻值偏差导致信号失真或功率损耗异常;
  2. 功率与电压:额定功率62.5mW(0.0625W),适配低功耗信号级应用;最大工作电压50V,覆盖5V/12V/24V等常规电子系统电压,无需额外降额即可稳定工作;
  3. 温度特性:温度系数(TCR)±100ppm/℃,即温度每变化1℃,阻值漂移约±37.4μΩ,宽温范围内漂移可控;
  4. 工作温度范围:-55℃~+155℃,符合工业级标准,可在极端环境(如户外传感器、汽车发动机舱周边)中长期运行。

三、封装与工艺特点

  1. 0402封装优势:英制尺寸0.04″×0.02″(公制1.0mm×0.5mm),体积仅为0603封装的1/4,大幅提升PCB布局密度,适配智能手机、智能穿戴等便携式设备的小型化趋势;
  2. 厚膜工艺特性:基于陶瓷基底的丝网印刷+高温烧结工艺,电阻膜层与基底结合紧密,具备:
    • 成本适中:相比薄膜电阻更具性价比,适合大规模量产;
    • 稳定性可靠:抗机械应力、环境腐蚀能力优于部分薄膜电阻;
    • 抗过载能力:短期1.5倍额定功率下仍保持性能稳定,降低电路故障风险。

四、典型应用场景

结合参数特性,该电阻核心应用包括:

  1. 便携式消费电子:智能手机/手表的电源管理(电池充放电限流)、蓝牙耳机的信号调理(传感器分压);
  2. 工业控制模块:小型PLC、温度/压力传感器接口的精密匹配电阻;
  3. 汽车辅助电子:胎压监测(TPMS)、车载USB过流保护、低功耗传感器信号处理;
  4. 通信设备:小型基站、路由器射频前端的滤波器匹配、信号衰减;
  5. 医疗电子:血糖仪、血压计的低功耗信号电路。

五、可靠性与环境适应性

该电阻通过多项行业测试,确保长期稳定:

  • 温度循环测试:-55℃~+155℃循环1000次,阻值变化率≤0.5%;
  • 湿度测试:85℃/85%RH环境1000小时,阻值变化率≤1%;
  • 耐焊接热:回流焊(260℃/10s)后无开裂、阻值无异常;
  • 环保合规:符合RoHS 2.0、REACH标准,无铅无卤。

六、品牌与品质保障

FOJAN(富捷)拥有10余年被动元件制造经验,产品覆盖全系列封装与精度等级。FRC0402F37R4TS通过ISO9001认证,部分批次满足IATF16949汽车电子标准,批量供货一致性好,可提供样品测试与定制化服务,适配客户量产需求。

该产品以“高精度+小体积+高可靠性”为核心,是小型化电子设备中替代传统电阻的优选方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.