Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FRC0402F51R0TS是富捷电子(FOJAN)推出的0402封装厚膜贴片电阻,针对小型化、低功耗电子设备的精准电阻匹配需求设计。其核心参数明确且适配主流应用场景:
该产品平衡了成本与性能,是中低端至中端电子设备规模化应用的理想选择。
采用标准0402贴片封装(尺寸约1.0mm×0.5mm),为当前小型化PCB布局的主流封装之一,可显著提升电路密度,适配自动化SMT生产流程(贴装效率高、兼容性强)。
核心工艺为厚膜电阻技术:通过在氧化铝陶瓷基底上印刷厚膜电阻浆料并高温烧结而成,相比薄膜电阻成本更低,且具备良好的稳定性;相比绕线电阻体积更小,无引线设计减少了寄生参数,提升了电路高频性能。
该电阻的参数特性适配以下场景:
富捷电子(FOJAN)是国内专注被动元件研发生产的厂商,FRC0402F51R0TS符合RoHS、REACH环保指令,批量供货稳定。产品通过高温存储、温度循环等可靠性测试,适合OEM/ODM厂商规模化应用,同时提供完善的技术支持与售后保障。
FRC0402F51R0TS凭借精准阻值控制、宽温适应性和紧凑封装,成为小型化电子设备中信号调理、分压限流场景的高性价比选择,平衡了性能与成本,满足多数中端应用的可靠性需求。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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