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FUXINSEMI BAT54W
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FUXINSEMI BAT54W
- Type
- FUXINSEMI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FUXINSEMI
- Electronic Component
- BAT54W
- Electronic Component
- 1
- Package
- SOD-123
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.034g
- Electronic Component
- 1
- Electronic Component
- BM0264880424
- Current
- 200mA
- Diode
- 1
- Current(Ir)
- 2uA
- (Vf)
- 1V@100mA
- Electronic Component
- 55℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAT54W 产品概述
一、产品简介
BAT54W（富芯森美 FUXINSEMI）是一款小型独立式肖特基二极管，采用SOD-123封装，面向便携电源、开关保护与高速整流场景。器件在100mA电流下正向压降典型为1V，直流反向耐压30V，静态反向电流仅2µA，额定整流电流200mA，能够满足中低功率、高速响应的整流与保护需求。
二、主要参数
- 二极管配置：1个独立式
- 正向压降 Vf：1V @ 100mA（典型）
- 直流反向耐压 Vr：30V
- 最大整流电流：200mA（DC）
- 反向漏电流 Ir：2µA（常温）
- 非重复峰值浪涌电流 Ifsm：13A（单次脉冲）
- 工作结温范围：-55℃ ~ +125℃
- 封装：SOD-123（表面贴装，小体积）
三、主要特性与优势
- 低泄漏与较高耐压的组合，适用于30V以内的保护与整流用途。
- SOD-123小封装利于表面贴装自动化生产，占板面积小。
- 较大的浪涌承受能力（13A峰值脉冲）可应对短时启动或浪涌事件。
- 宽温度范围适合工业级应用环境。
四、典型应用
- 反向极性保护与输入防反接电路（便携式装备、电源输入）。
- 低压差整流与二极管限幅（通信、电池管理、单片机电源保护）。
- 快速开关与防钩环路（开关电源次级整流、小信号保护）。
- 浪涌吸收与瞬态钳位配合抑制元件使用。
五、设计与使用注意事项
- 正向压降在100mA时约1V，设计中应预留功耗和发热余量；长期工作时建议对结温进行评估与降额。
- 若长期大电流使用，应关注PCB散热，增加铜箔面积或热过孔以降低结温。
- 在高温下反向漏电流可能上升，关键场合建议做温度裕量或选用低Ir等级器件。
- Ifsm为单次峰值浪涌能力，不可作为连续导通评价；合理防护以免重复冲击。
六、封装与可靠性
SOD-123为常见小封装，适合批量贴装和回流焊工艺。器件通过常规热循环、机械应力与湿热试验后符合工业级可靠性要求；在严苛环境下建议按实际工况做额外寿命评估与加速老化测试。
七、替代型号与选型建议
若需更低正向压降或更高电流能力，可考虑更高规格肖特基（如1N5819、SS14等）或封装更大功率器件；若空间受限且要求更低Vf，可选用低Vf型小封装肖特基。选型时以最大工作电流、允许压降、反向耐压与环境温度为主导因素。
如需器件封装图、引脚定义、典型伏安特性曲线或样品与报价信息，我可进一步提供。
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