WMSIC Electronic Components

FUXINSEMI BAT54WS

ModelBAT54WS
PackageSOD-323(SC-90)
BrandFUXINSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FUXINSEMI BAT54WS
Type
FUXINSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FUXINSEMI
Electronic Component
BAT54WS
Electronic Component
1
Package
SOD-323(SC-90)
Electronic Component
Schottky Diode
Electronic Component
0.025g
Electronic Component
1
Electronic Component
BM0230032092
Current
200mA
Diode
1
Current(Ir)
2uA
(Vf)
1V@100mA
Electronic Component
40℃~+125℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BAT54WS 产品概述

一、产品简介

BAT54WS 是富芯森美(FUXINSEMI)推出的一款肖特基整流二极管,采用 SOD-323(SC-90)小型贴片封装,面向空间受限的低功耗整流与保护应用。器件以低正向压降和极低反向泄漏为主要特性,适合用于便携设备、信号整流与保护电路等场景。

二、主要电气参数

  • 正向压降 (Vf):1.0 V @ 100 mA
  • 直流反向耐压 (Vr):30 V
  • 整流电流(最大/平均):200 mA
  • 反向电流 (Ir):2 μA
  • 非重复峰值浪涌电流 (Ifsm):600 mA(一次性峰值)
  • 工作结温范围:-40 ℃ ~ +125 ℃
  • 封装:SOD-323 (SC-90)
  • 品牌:FUXINSEMI(富芯森美)

三、核心特性与优势

  • 低正向压降:在中等电流下仍保持较低的压降,降低功耗与发热,有利于提高系统效率。
  • 极小反向泄漏:2 μA 的反向电流在高阻抗或低漏电要求的电路中表现优异,适合电池供电或待机场景。
  • 小尺寸封装:SOD-323 尺寸小、寄生电感低,适合高密度贴装与高频应用。
  • 抗冲击能力:600 mA 的非重复峰值浪涌能力提供短时冲击保护能力(注意不宜长期频繁冲击)。

四、典型应用场景

  • 低压差整流与二极管耦合电路(小功率电源整流)
  • 反向/极性保护与防反接电路
  • 高频检测与整流(射频检测器、混频输出整流)
  • 电平移位、钳位及信号保护电路
  • 便携及电池供电设备的能耗控制与待机保护

五、封装、热性能与可靠性

SOD-323 小封装限制了器件的散热能力,连续整流电流在高环境温度或散热受限情况下需做适当降额处理。请注意热阻及PCB铜箔面积对结温的影响:增大焊盘与地铜可有效降低结温,提高可靠性。器件额定结温为 -40 ℃ 至 +125 ℃,符合多数消费电子与工业级应用温度要求。

六、设计与使用建议

  • 连续工作电流接近 200 mA 时,应评估 PCB 散热条件并适度降额使用,避免长期在最高额定值工作。
  • 对于冲击电流频繁出现的场合,优先考虑更大封装或更高 Ifsm 规格器件;Ifsm 600 mA 适合偶发浪涌但不适合反复承受大电流脉冲。
  • PCB 布局中为器件提供适当的散热铜量,并缩短回流路径以降低寄生电感与电阻。
  • 在敏感信号路径使用时,结合滤波与旁路电容以抑制切换噪声。
  • 参考厂商数据手册获取回流焊曲线、封装尺寸与焊盘推荐,以保证贴装可靠性。

七、采购与注意事项

购买时请确认具体型号与参数(厂家料号、出厂批次),并索取最新数据手册以获取完整电气特性曲线与封装图。SOD-323 为常见 SMT 封装,通常以卷带(Tape & Reel)形式供应,适合自动贴片生产。若应用对反向耐压、漏电或寿命有更高要求,可与供应商沟通样品测试或选型更高规格的肖特基器件。

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