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FUXINSEMI SS510A
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FUXINSEMI SS510A
- Type
- FUXINSEMI
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FUXINSEMI
- Electronic Component
- SS510A
- Electronic Component
- 1
- Package
- SMA(DO-214AC)
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.094g
- Electronic Component
- 1
- Electronic Component
- BM0265133015
- Current
- 5A
- Diode
- 1
- Current(Ir)
- 500nA
- (Vf)
- 850mV@5A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS510A 产品概述
一、产品简介
SS510A 为 FUXINSEMI（富芯森美）推出的肖特基整流二极管，封装为 SMA（DO-214AC）。该器件以低正向压降和高整流能力为特点，适用于开关电源、整流及功率保护等对效率和散热有较高要求的场合。器件耐热范围广，适应工业级温度环境。
二、主要电气参数
- 正向压降（Vf）：约 850 mV @ If = 5 A（低压降，有助于降低整流损耗）
- 额定整流电流：5 A（连续直流整流）
- 直流反向耐压（Vr）：100 V（最高反向承受电压）
- 反向漏电流（Ir）：典型 500 nA（标称条件下，温度升高时漏电流会增加）
- 非重复峰值浪涌电流（Ifsm）：150 A（瞬态抗冲击能力，具体测量条件请参照厂商数据表）
- 工作结温范围：-55 ℃ 至 +150 ℃
以上参数为器件典型/额定值，详细测试条件和极限参数应以厂家数据手册为准。
三、封装与热性能
- 封装形式：SMA（DO-214AC），适合自动贴装与波峰/回流焊工艺。
- 热管理建议：在最大整流电流工作下需保证良好铜箔散热，推荐在 PCB 上扩展焊盘和散热铜面积；必要时采用底层散热过孔或散热片以降低结温，提高可靠性。
四、典型应用场景
- 开关电源（SMPS）输出整流
- 反向保护与续流二极管（DC-DC 转换器、马达驱动）
- 适配器与充电器整流
- 电源管理与保护电路，需兼顾效率与抗浪涌能力的场合
五、使用与选型建议
- 若系统对效率敏感，低 Vf（850 mV@5A）能显著减少整流功耗；但应评估工作点（电流大小、占空比）以确认节能效果。
- 注意反向漏电流随温度上升显著增大，若工作温度较高或在高阻负载下应评估漏电对系统的影响。
- 如果需要更高反向耐压或更低漏电，考虑其它型号或并联/串联方案，但并联需注意电流分配。
- PCB 布局避免长导线与散热受限区域，焊接时遵循 SMA 的热工艺规范以防止热应力损伤。
六、可靠性与注意事项
- 非重复峰值浪涌电流仅表示瞬态冲击能力，不可作为长期工作电流；频繁浪涌会降低寿命。
- 工作在高温或高反向电压时，需关注漏电流与热失控风险，设计中留有安全裕度。
- 建议按行业标准进行ESD与浪涌保护设计，防止瞬态过压损坏器件。
七、包装与技术支持
- 封装适配常规贴片生产流程，供应商提供卷装/带装等标准包装形式。
- 详细电气特性曲线、脚位图、焊接工艺建议及可靠性试验数据请参阅 FUXINSEMI 官方数据手册或向供应商索取样片与技术支持。
总结：SS510A 为一款面向中高功率整流及保护用途的肖特基二极管，特点是较低正向压降与良好的瞬态浪涌承受力。在实际应用中应综合考量结温、漏电与散热设计，以发挥器件最佳性能。
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