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FUXINSEMI ES1JA
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FUXINSEMI ES1JA
- Type
- FUXINSEMI
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FUXINSEMI
- Electronic Component
- ES1JA
- Electronic Component
- 1
- Package
- SMA(DO-214AC)
- Electronic Component
- Fast Recovery / High-Efficiency Diode
- Electronic Component
- 0.1g
- Electronic Component
- 1
- Electronic Component
- BM0264480223
- Current
- 1A
- Diode
- 1
- Current(Ir)
- 5mA
- (Vf)
- 1.7V@1A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ES1JA 产品概述 — 快恢复/高效率二极管（600V，1A，SMA）
一、产品简介
ES1JA 是 FUXINSEMI（富芯森美）推出的一款单只独立式快恢复/高效率二极管，封装为 SMA（DO-214AC）。该器件在开关应用中具有较短的反向恢复时间（Trr=35ns）和较高的反向耐压（Vr=600V），整流电流为 1A，适用于中高压开关电源、整流与续流场合。
二、主要电气参数
- 正向压降 Vf：1.7V @ 1A（典型/测试条件下）
- 直流反向耐压 Vr：600V（最高允许反向电压）
- 平均整流电流：1A（在规定散热条件下）
- 峰值非重复浪涌电流 Ifsm：30A（单次浪涌能力）
- 反向漏电流 Ir：5mA（常温/指定测试电压下）
- 反向恢复时间 Trr：35ns（快恢复特性，有利于降低开关损耗）
- 工作结温范围：-55°C 至 +150°C
三、封装与机械特性
ES1JA 采用 SMA（DO-214AC）表面贴装封装，具有体积小、可靠性高、易于自动贴装焊接的优点。SMA 封装便于在 PCB 上紧凑布局，并通过良好走铜来提高热散能力。具体焊接和封装尺寸请参照官方数据手册。
四、典型应用场景
- 开关电源（SMPS）二次侧整流与续流二极管
- 工业电源与适配器的高压整流与保护
- 逆变器、伺服驱动与电机驱动的续流回路
- 充电设备与电源模块的浪涌吸收与钳位
- 需要兼顾高耐压与较快恢复速度的功率电子电路
五、使用与可靠性建议
- 散热与降额：在长期1A整流工作状态下应保证良好 PCB 散热路径，必要时在铜箔区域加大散热面积或并联器件降额使用。
- 反向漏电随温度上升增大：高温环境下 Ir 会显著增加，应考虑热设计与电路容忍度。
- 浪涌保护：Ifsm 为非重复峰值浪涌能力（30A），仅限短时单次冲击（参照数据手册浪涌波形与时长），不能作为长期过流方案。
- 开关噪声与恢复：尽管 Trr=35ns 属快恢复，但在高 dV/dt 环境仍可能产生振铃或电磁干扰，必要时配合 RC 缓冲或良好布局抑制尖峰。
- 焊接要求：遵循厂家推荐的回流焊工艺曲线，避免超出最高结温和封装机械应力。
六、选型参考与替代
ES1JA 以 600V 的耐压与 35ns 的恢复时间，在高压开关整流与续流应用中具有较好性价比。选型时应结合系统工作电压、开关频率（高频时需关注恢复特性与损耗）、热设计与漏电容要求。如需更低正向压降或更小漏电流，可参考其他系列或并联/串联组合方案，最终以原厂数据手册为准。
总结：ES1JA 提供了在高电压场合下兼顾快恢复和高效率的解决方案，适合要求耐压高、开关损耗低且体积受限的功率电子应用。购买与设计前请参照 FUXINSEMI 官方数据手册以获取完整电气特性曲线与封装信息。
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