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FUXINSEMI SB10100L
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FUXINSEMI SB10100L
- Type
- FUXINSEMI
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FUXINSEMI
- Electronic Component
- SB10100L
- Electronic Component
- 1
- Package
- TO-277B
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.16g
- Electronic Component
- 1
- Electronic Component
- BM0265133031
- Current
- 10A
- Diode
- Electronic Component
- Current(Ir)
- 200uA@100V
- (Vf)
- 700mV@10A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SB10100L 产品概述
一、产品简介
SB10100L 为富芯森美（FUXINSEMI）出品的独立式肖特基二极管，封装为 TO-277B。该器件在10A 工作电流下具有典型正向压降 0.70V（Vf@10A），反向耐压为 100V，适用于需要低正向压降、快速恢复和高效率整流的电源与功率应用场景。
二、主要电气参数
- 二极管类型：肖特基（独立式）
- 正向压降：700mV @ 10A（典型）
- 额定整流电流：10A（直流）
- 直流反向耐压（Vr）：100V
- 反向电流：200μA @ 100V（室温）
- 非重复峰值浪涌电流（Ifsm）：175A（脉冲峰值，具体脉冲波形与持续时间以厂商资料为准）
- 工作结温范围：-55℃ ~ +150℃
- 封装：TO-277B（独立式散热引脚/底座）
三、产品特性与优势
- 低正向压降：0.7V @10A 的低压降可显著降低导通损耗，提高整机效率，尤其适合高电流整流或降压应用。
- 低反向恢复：肖特基结构本征具有快速响应和极低反向恢复特性，有利于高频开关电源和整流场合。
- 宽工作温区：-55℃~+150℃ 的结温范围，适用于工业与汽车级等苛刻环境。
- 封装散热能力好：TO-277B 提供良好的热传导通路，便于外部散热器或PCB散热处理。
四、典型应用
- 开关电源（二次整流）与线性整流
- DC-DC 转换器、同步整流替代件
- 逆变器、太阳能逆变/充电系统
- 电池保护、反接保护与钳位电路
- 电机驱动与功率模块中作为自由轮二极管
五、封装与热管理建议
TO-277B 封装在高电流应用中仍需良好散热设计：建议搭配适当散热片或利用大面积 PCB 铜箔与多通孔导热。实际工作电流接近 10A 时，应评估结-环境温升并按厂商热阻参数进行额定电流降额计算。注意反向漏电随温度上升显著增加，需在高温工况下验证漏电与热稳定性。
六、设计注意事项
- 验证脉冲浪涌能力：Ifsm 仅为非重复峰值，且受脉冲宽度与初始结温影响，设计需留有裕量以防浪涌损坏。
- 反向漏电：200μA@100V 为室温典型值，高温时会增加，应在高温条件下确认是否影响系统性能。
- 版图与焊接：保持低阻连接、短走线以减少压降与热集中，焊接工艺应避免过热以保护器件特性。
七、检验与采购提示
选型时请参考厂方完整数据手册，确认正向压降曲线、热阻、浪涌条件与封装机械尺寸。富芯森美（FUXINSEMI）SB10100L 适合追求低导通损耗与可靠散热的中高功率设计，批量采购前建议先行样品测试以验证在目标系统中的实际表现。
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