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FUXINSEMI DSK210
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FUXINSEMI DSK210
- Type
- FUXINSEMI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FUXINSEMI
- Electronic Component
- DSK210
- Electronic Component
- 1
- Package
- SOD-123
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.036g
- Electronic Component
- 1
- Electronic Component
- BM0264480216
- Current
- 2A
- Diode
- 1
- Current(Ir)
- 100uA
- (Vf)
- 850mV@2A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
DSK210 肖特基二极管 产品概述
一、产品简介
DSK210 为 FUXINSEMI（富芯森美）推出的一款高压低压降肖特基整流二极管，单只独立器件，封装为 SOD-123。该器件在中等功率开关及整流场合提供低正向压降与快速恢复性能，适合要求效率与体积兼顾的电源方案。
二、主要特性
- 正向压降 Vf ≈ 850 mV @ 2 A（室温测试）
- 直流反向耐压 Vr = 100 V
- 额定整流电流 IO = 2 A（连续）
- 非重复峰值浪涌电流 Ifsm = 45 A
- 反向漏电流 Ir 在室温典型值 ≤ 500 nA；随结温升高会增加（高温时可能到数十至上百微安）
- 工作结温范围 -55 ℃ ～ +150 ℃
三、电气与热性能要点
DSK210 在 2 A 工况下保持较低的正向压降，有利于减少导通损耗并提升效率。SOD-123 小型表面贴装封装适用于空间受限的板级设计。器件热阻及散热受 PCB 布局影响明显，建议配合散热铜箔与过孔以降低结温，保证长期可靠性。
四、典型应用
- 开关电源输入整流与输出整流
- 逆向保护、反向并联保护
- 电池管理与充电电路中低压降整流
- 太阳能微逆变器、LED 驱动、DC-DC 转换器中的高效整流
五、封装与装配
SOD-123 封装，兼容常见 SMT 贴装工艺。建议按厂家推荐的回流曲线进行焊接，避免过长高温暴露；焊盘设计与热铜扩展需结合实际功率损耗优化。
六、可靠性与选型建议
在高温、高浪涌应用下，应留有足够的安全裕度：评估 Ifsm 及结温上升，对 PCB 散热与浪涌吸收电路（如限流、软启动）进行配合。如对漏电流有严格要求，考虑温升工况下的最大 Ir，或选择更低漏电的器件。
七、订购信息
型号：DSK210
品牌：FUXINSEMI（富芯森美）
封装：SOD-123
在选型时请参照厂家完整数据手册获取详细的极限参数、典型特性曲线及回流焊规范。
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