Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
FUXINSEMI SK106C
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FUXINSEMI SK106C
- Type
- FUXINSEMI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FUXINSEMI
- Electronic Component
- SK106C
- Electronic Component
- 1
- Package
- SMC(DO-214AB)
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.3g
- Electronic Component
- 1
- Electronic Component
- BM0230804558
- Current
- 10A
- Diode
- Electronic Component
- Current(Ir)
- 500uA@60V
- (Vf)
- 700mV@10A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SK106C 产品概述
一、产品简介
SK106C 是富芯森美（FUXINSEMI）推出的一款独立式肖特基整流二极管，封装为 SMC（DO-214AB）。其典型正向压降为 0.7V（在 10A 时测得），直流反向耐压为 60V，整流电流 10A，适合中高电流、低压降的整流与续流场合。工作结温范围宽，-55℃ 至 +150℃，便于在严苛环境下使用。
二、主要电气参数
- 型号：SK106C
- 品牌：FUXINSEMI（富芯森美）
- 封装：SMC (DO-214AB)
- 正向压降：0.7V @ IF = 10A
- 直流反向耐压（Vr）：60V
- 整流电流：10A（连续）
- 反向电流（Ir）：500μA @ Vr = 60V
- 工作结温：-55℃ ~ +150℃
三、热与机械特性
SMC 封装提供良好的散热面积与机械强度。实际应用中应通过合理的 PCB 铜箔厚度、散热铜皮和过孔（via）布线来降低结到环境的热阻，确保在高电流下结温不会超过额定上限。尽管器件额定结温可达 150℃，为保证长期可靠性建议在设计中考虑热边际并进行适当降额。
四、典型应用场景
- 开关电源（AC/DC、DC/DC）整流与输出续流二极管
- 逆变器与电机驱动的续流保护
- 汽车电子低压系统（注意浪涌与瞬态抑制）
- 电池保护与充放电路径
- 太阳能逆变器、LED 驱动等需要低压降、高效率的应用
五、优势与选型要点
- 低正向压降（0.7V@10A），可显著减少导通损耗，提高系统效率。
- SMC 封装支持较高的平均整流电流和较好的热散能力，利于中高功率应用。
- 反向电流 500μA 在 60V 下属于可接受范围，但肖特基器件反向漏流随温度上升显著增加，需在高温条件下注意漏流带来的发热与电路影响。
- 选型时注意系统最高工作电压与浪涌电压，必要时增加吸收元件或选择更高 Vr 等级的型号。
六、封装与安装建议
- 推荐在焊盘下方和外围增加足够的铜面积并使用多孔过孔将热量传导到下层铜箔。
- 采取符合 IPC/JEDEC 的回流焊工艺，避免超出器件的热冲击限制（详见厂家焊接规范）。
- 适当留出热散空间，不要将器件与高发热元件紧贴。
七、可靠性与使用注意事项
- 反向漏流随温度升高而增长，长时间在高温高压环境中使用会加速漏流与自热，建议设计合理的热管理与温度监控。
- 注意浪涌电流能力（脉冲峰值）与重复冲击，设计时应核对完整数据手册中的峰值参数及测试条件。
- 系统级使用时应结合 TVS、RC 吸收等保护措施防止瞬态过压。
八、结论
SK106C 为一款面向中高电流、低压降需求的肖特基整流二极管，适用于开关电源、续流保护及各类电源管理场合。其 SMC 封装带来良好的热管理能力，但在高温与高电压工作点应注意反向漏流与结温管理。选型时建议参考完整数据手册并依据实际应用环境进行热仿真与可靠性验证。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
