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FUXINSEMI SS36A
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FUXINSEMI SS36A
- Type
- FUXINSEMI
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FUXINSEMI
- Electronic Component
- SS36A
- Electronic Component
- 1
- Package
- SMA(DO-214AC)
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.098g
- Electronic Component
- 1
- Electronic Component
- BM0264480240
- Current
- 3A
- Diode
- 1
- Current(Ir)
- 500nA
- (Vf)
- 700mV@3A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS36A 肖特基整流二极管 产品概述
一、产品简介
SS36A 是一款单颗独立式肖特基整流二极管，适用于中等电流整流与保护场合。由 FUXINSEMI（富芯森美）生产，封装为 SMA (DO-214AC)，额定整流电流 3A，直流反向耐压 60V。其在 3A 测试电流下典型正向压降为 700mV，静态反向漏电流较小（500nA），工作结温范围 -55℃ 至 +150℃，适合对低压降与快速整流有要求的应用。
二、主要参数
- 器件类型：肖特基整流二极管（独立式，单个）
- 正向压降 (Vf)：700mV @ If = 3A
- 直流反向耐压 (Vr)：60V
- 平均整流电流：3A
- 反向漏电流 (Ir)：500nA（典型，温度相关）
- 工作结温：-55℃ ~ +150℃
- 封装：SMA (DO-214AC)
三、主要特性与优势
- 低正向压降：在高电流工作时可显著降低功耗和发热，有利于提高系统效率。
- 低反向漏电流：静态漏电小，适用于待机功耗严格的电源与保护电路。
- 宽温度范围：-55℃ 至 +150℃，适应工业级环境。
- SMA 封装：体积小、焊接可靠，便于自动化贴装及批量生产。
四、典型应用场景
- 开关电源整流与续流（flyback、buck、boost 等）
- 逆向保护、反接保护电路
- 电池充放电控制与保护回路
- 汽车电子（符合温度与电压等级时）
- 工业设备的低压快速整流与二次保护
五、使用建议与注意事项
- 热管理：尽管 Vf 较低，但在持续 3A 工作下仍产生显著热量。建议在 PCB 上增加铜箔散热面积或将器件靠近散热体布局，避免长期高温运行导致寿命下降。
- 温度影响：反向漏电流随温度升高而增加，实际设计时需考虑高温环境下的漏电和功耗裕度。
- 焊接工艺：SMA 封装兼容常规回流焊工艺。推荐按 PCB 制造商与组装厂的回流曲线进行操作，避免过高峰值温度或过长保温时间。
- 极性与布局：注意正确极性标识，电流走向应与 PCB 导线及散热设计匹配以降低寄生阻抗和局部过热。
- 瞬态与浪涌：对冲击电流或反复浪涌场合，建议评估器件的浪涌承受能力并配合限流、熔断或抑制元件以提高可靠性。
六、封装与可靠性说明
SMA (DO-214AC) 为常用表面贴装封装，体积与热阻介于 SOD 与更大型封装之间，兼顾热性能与空间占用。器件经过制造与测试以满足工作结温范围内的电气特性稳定性，但在高温或反复热循环工况下仍需采取适当的热设计与电流限值策略以延长使用寿命。
如需 weitere（更多）技术数据（如脉冲浪涌能力、热阻曲线、典型 I-V、反向恢复等），建议参考厂方完整版数据手册或联系 FUXINSEMI 技术支持获取详细参数与可靠性试验报告。
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